+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Europe secures Europractice services to European academia and industry

Imec and its partners STFC-UKRI, Fraunhofer IIS, CMP and Tyndall announced today that Europractice was selected and granted European funding as a H2020 project. This new funding secures the Europractice services to European universities, research institutes and industry until the end of 2021. In the new H2020-project named Next Europractice eXtended Technologies and Services (NEXTS), new partners CMP and Tyndall complement and extend the Europractice offering.

Europractice has supported the European academic sector with design tools and IC prototyping for almost 30 years. The NEXTS project will integrate and build upon the well-established, widely-used and successful services offered by the project partners, extending the service to SMEs, encouraging new users from non-traditional sectors, adding new technologies to serve new markets, diversifying the service towards smart system integration and packaging, and support the training of future generations of engineers that will be required for the growing digital economy in Europe.

The NEXTS project has received funding from the European Union’s Horizon 2020 research and innovation programme under the grant agreement No 825121.

Europe secures Europractice services to European academia and industry

Imec and its partners STFC-UKRI, Fraunhofer IIS, CMP and Tyndall announced today that Europractice was selected and granted European funding as a H2020 project. This new funding secures the Europractice services to European universities, research institutes and industry until the end of 2021. In the new H2020-project named Next Europractice eXtended Technologies and Services (NEXTS), new partners CMP and Tyndall complement and extend the Europractice offering.

Europractice has supported the European academic sector with design tools and IC prototyping for almost 30 years. The NEXTS project will integrate and build upon the well-established, widely-used and successful services offered by the project partners, extending the service to SMEs, encouraging new users from non-traditional sectors, adding new technologies to serve new markets, diversifying the service towards smart system integration and packaging, and support the training of future generations of engineers that will be required for the growing digital economy in Europe.

The NEXTS project has received funding from the European Union’s Horizon 2020 research and innovation programme under the grant agreement No 825121.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: