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Trymax Launches a Brand-New UV Curing and Charge Erase Product Line


Trymax Semiconductor Equipment BV (Trymax), a provider of plasma solutions for semiconductor manufacturers, has announced the addition of an ultraviolet (UV) curing and charge erase product line to its portfolio. The system called NEO 2000UV is a leading-edge dual chamber solution compliant with wafer sizes up to 200 mm.

UV curing and charge erase equipment are used for a wide range of applications that includes photostabilization of the resist prior implantation or etch, for small CD, or to erase charge built-up during the IC manufacturing process. This new offer from Trymax will contribute to support the 200 mm wafer capacity increase over the period 2019-2022 forecasted by SEMI in its latest report*.

The decision of Trymax to develop such new product was based on the market demand. Several IC fabs were facing difficulties to find UV curing/charge erase equipment to expand their manufacturing capacity or simply maintain their existing toolset. Customers had to rely mainly on the rarely available refurbished equipment and parts.

“By launching NEO 2000UV, Trymax offers longer term perspective to IC manufacturers”, stated Ludo Vandenberk, Executive Vice President of Trymax. “This new product line extends Trymax capabilities to support the semiconductor industry and will generate value for customer by enabling higher yield in wafer manufacturing.”

NEO 2000UV has been designed taking advantage of the reliable NEO platforms developed by Trymax for plasma ashing, descum, and etching applications. NEO 2000UV is implementing state-ofthe-art robotics, components, the latest digital technologies and software, and is CE compliant. NEO 2000UV can accommodate cassettes or SMIFs. It is manufactured in the Netherlands.

First shipments of pre-ordered systems will start in early Q3 2019. Customers interested to run demonstrations in Trymax application lab are invited to contact Trymax.

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