+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Pfeiffer Vacuum Introduces New High-Performance Roots Vacuum Pumps


Pfeiffer Vacuum has introduced the new Roots pumps of the HiLobe series. These compact pumps can be used for numerous industrial vacuum applications such as electron beam welding, vacuum furnaces or freeze drying The pumps of the HiLobe series are of particular interest for fast evacuations (load-lock chambers or leak detection systems). Furthermore, they are suitable for use in coating applications.

The compact Roots pumps offer a wide nominal pumping speed range of 520 - 2,100 m3/h. This is made possible through the new drive concept in conjunction with frequency converters. The pumps can be precisely tailored to customer-specific requirements utilizing individual speed control. The new drive concept, permits HiLobe to achieve approximately 20 percent shorter pump-down times than conventional Roots pumps. Rapid evacuation reduces costs and increases the efficiency of the production system.

The maintenance and energy costs of the HiLobe are more than 50% lower compared to conventional Roots pumps. This is due to a drive with energy efficiency class IE4 and the special rotor geometries of the pumps. The pumps are hermetically sealed to the atmosphere and have a maximum integral leakage rate of 1·10-6 Pa m3/s. Dynamic seals are eliminated and, as a result, maintenance is only required every four years. An innovative sealing concept in the suction chamber makes the use of sealing gas superfluous in most applications, which also has a positive effect on the operating costs. Since the operation of the HiLobe Roots pumps is possible even at ambient temperatures of up to over 40°C with flexible air cooling, cost-intensive water cooling is unnecessary.

Control and communication are the essential factors for increasing system availability. The intelligent interface technology of the HiLobe allows very good adaptation and monitoring of the processes. By integrating condition monitoring, information about the condition of the vacuum system is always available. In addition, condition monitoring increases system availability, allowing users to plan maintenance and repair measures in a useful and anticipatory way and prevents cost-intensive production downtimes. These advantages lead to a long service life and maximum operational safety. HiLobe vacuum pumps can either be aligned vertically or horizontally. This allows maximum pumping speed and a more customized and efficient use of space at the customer's production site.

"With the HiLobe Roots pumps our customers are able to reduce energy and operating costs and consequently make production more cost-efficient. For a sustainable reduction of energy consumption and operating costs, it is not enough to solely base it on the energy requirements of a vacuum pump. The type of cooling, the maintenance intervals and the control also have a decisive influence on the overall energy balance. We are proud to be able to offer our customers this holistic approach," says Dr. Ulrich von Hülsen, CTO of Pfeiffer Vacuum Technology AG.

Pfeiffer Vacuum Introduces New High-Performance Roots Vacuum Pumps

Pfeiffer Vacuum, one of the world's leading providers of vacuum technology, has introduced the new Roots pumps of the HiLobe series. These compact pumps can be used for numerous industrial vacuum applications such as electron beam welding, vacuum furnaces or freeze drying The pumps of the HiLobe series are of particular interest for fast evacuations (load-lock chambers or leak detection systems). Furthermore, they are suitable for use in coating applications.

The compact Roots pumps offer a wide nominal pumping speed range of 520 - 2,100 m3/h. This is made possible through the new drive concept in conjunction with frequency converters. The pumps can be precisely tailored to customer-specific requirements utilizing individual speed control. The new drive concept, permits HiLobe to achieve approximately 20 percent shorter pump-down times than conventional Roots pumps. Rapid evacuation reduces costs and increases the efficiency of the production system.

The maintenance and energy costs of the HiLobe are more than 50% lower compared to conventional Roots pumps. This is due to a drive with energy efficiency class IE4 and the special rotor geometries of the pumps. The pumps are hermetically sealed to the atmosphere and have a maximum integral leakage rate of 1·10-6 Pa m3/s. Dynamic seals are eliminated and, as a result, maintenance is only required every four years. An innovative sealing concept in the suction chamber makes the use of sealing gas superfluous in most applications, which also has a positive effect on the operating costs. Since the operation of the HiLobe Roots pumps is possible even at ambient temperatures of up to over 40°C with flexible air cooling, cost-intensive water cooling is unnecessary.

Control and communication are the essential factors for increasing system availability. The intelligent interface technology of the HiLobe allows very good adaptation and monitoring of the processes. By integrating condition monitoring, information about the condition of the vacuum system is always available. In addition, condition monitoring increases system availability, allowing users to plan maintenance and repair measures in a useful and anticipatory way and prevents cost-intensive production downtimes. These advantages lead to a long service life and maximum operational safety. HiLobe vacuum pumps can either be aligned vertically or horizontally. This allows maximum pumping speed and a more customized and efficient use of space at the customer's production site.

"With the HiLobe Roots pumps our customers are able to reduce energy and operating costs and consequently make production more cost-efficient. For a sustainable reduction of energy consumption and operating costs, it is not enough to solely base it on the energy requirements of a vacuum pump. The type of cooling, the maintenance intervals and the control also have a decisive influence on the overall energy balance. We are proud to be able to offer our customers this holistic approach," says Dr. Ulrich von Hülsen, CTO of Pfeiffer Vacuum Technology AG.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: