Technoprobe To Acquire Microfabrica
Technoprobe, a provider of microelectronics/semiconductor test industry, has reached a definitive agreement to acquire Microfabrica Inc., supplier of in high-volume production, microscale Additive Manufacturing. This acquisition is part of Technoprobe's $100M USD 2019-2020 self-funded technological investment plan. Post-acquisition, Microfabrica will continue to operate independently out of its headquarters in Van Nuys, California.
"This acquisition marks a strategic step in our growth plans," said Technoprobe CEO Stefano Felici. "As technological leaders in our fields, joining forces will accelerate both organizations' development efforts, so we can launch a variety of breakthrough products aimed at the SOC and memory market segments. Our plan to further invest in Microfabrica will help the company expand its capabilities and achieve its global market potential."
Microfabrica CEO Eric C. Miller added, "We are very excited to join the Technoprobe family. The acquisition will not only provide a strong foundation for Microfabrica and our employees but will enable us to expand our process and materials capabilities and services, benefiting the entire industry. We look forward to engaging new customers as well as continuing to serve our current base as we have done in the past: satisfying all contracts, NDAs and production commitments."
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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