+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Keysight Integrates PathWave with Samsung’s 28FDS Process Design Kit

Keysight Technologies has announced that PathWave Advanced Design System (ADS) and PathWave RFIC Design (GoldenGate) are integrated with the latest interoperable process design kit (iPDK) from Samsung for the 28FDS (28nm fully-depleted silicon-on-insulator) process technology. As a result, designers can jumpstart chip design work, reducing development time and costs.

Keysight’s PathWave is a software platform that enables agile and connected design and test. It accelerates product development by modernizing engineering workflows, connecting simulation and measurement data throughout the design, test, and manufacturing lifecycle.

Samsung’s 28FDS process technology combines high performance and low power consumption with responsiveness to power management design techniques and is showing promise for modern mobile and consumer multimedia chips. The new iPDK from Samsung enables designers to quickly create circuit designs and perform simulations.

“The integration of Samsung Foundry’s 28FDS technology for design and simulation with Keysight PathWave design solutions is the beginning of a new partnership between the two companies under Keysight’s Foundry Program,” said Punmark Ngangom, RFIC Foundry Program manager for Keysight Technologies. “Our mutual customers will be able to start their designs in PathWave ADS, or leverage the interoperability feature, to bring in designs from other EDA tools with Samsung’s 28FDS iPDK and do accurate circuit simulations and optimizations in PathWave ADS.”

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: