Info
Info
News Article

CEA-Leti And UnitySC To Fuel Industry 4.0 With Smarter Tools

News

Leti, a research institute of CEA Tech, and UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced a four-year extension of their collaboration to further advance metrology-inspection capabilities per tool, while reducing the tools' footprint and cost of ownership.

CEA-Leti and UnitySC have been working on the development of a metrology-inspection platform for the past four years. The initial targeted applications were 3D integration modules, specialty bonding, and CMP. So far, the collaboration has helped advance UnitySC's system from a tabletop tool to a fully automated 200-300 mm Swiss Army knife-like platform that has shown very good performance during the validation phase. Today, UnitySC and CEA-Leti extend this collaboration to finalize the improvement of the platform and enhance its application space.

The extended collaboration also will address smarter tools for Industry 4.0. CEA-Leti and UnitySC will specifically work towards improving the platform's ease of use and reliability, enhancing the multi-sensor approach of today's tools, and bringing intelligence to the platform by adding innovative artificial intelligence (AI) approaches.This new generation of the platform, announced during SEMICON West, will allow users to tackle several control problems on different applications. These include buried interface defects on Si and GaN, and SiC edge defectivity control, as well as etch and roughness, bonded wafers and chip-to-wafer alignment, among others.

SUSS MicroTec And SET To Develop Equipment Solution For 3D Chip Integration
Imec Demonstrates Significant Performance Gains Utilizing Backside 3D SOC Interconnects
Park Systems Combines AFM With White Light Interferometry
ALD Is Taking Off In More-than-Moore Applications
Are You Facing Decisions And Challenges With Interconnects, Pattern Transfer, 3D Scaling And Atomic Scale Processing And Integration?
YES Partners With Osiris For Edge Film Removal Technology
EV GROUP Brings High-speed High-precision Metrology To 3D Heterogeneous Integration
Mycronic Receives Order For An SLX Mask Writer
BASF And Entegris Sign Agreement On Sale
ERS Electronic Appoints Mark Wachter As Chief Financial Officer
Siemens Collaborates With PDF Solutions To Boost IC Yield And Speed Time
The All-round Smart Proximity Sensor Chip
Kurt J. Lesker Acquires KDF Electronics & Vacuum Services
SiLC Rolls Out Chip-Integrated FMCW LiDAR Sensor
CEA-Leti Breakthrough For Next-Generation Memories And RRAM Energy-Storage
CEA-Leti Unveils Navigation-Grade Gyroscopes
Edwards Launches New Cryopump
Detecting And Classifying Defects In Semiconductor Manufacturing Via Atomic Force Microscopy
3D-Micromac AG Appoints Hartmut Schubert To Chief Technology Officer
Brewer Science’s Newly Launched Smart Devices Will Be Displayed At CES
Brewer Science Presents Best Practices For Workplace Culture At SEMICON West
3D-Micromac AG Appoints Marko Gerlach Chief Financial Officer
ULVAC Expands Process Capability
NTU Singapore Launches Quantum Science And Engineering Centre

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
Live Event