Info
Info
News Article

Thin Film Quality Control For MEMS & Sensor Fabrication

News

SENTECH Instruments is a supplier of plasma process technology equipment for etching and deposition and thin film metrology instruments based on spectroscopic ellipsometry.

SENTECH proudly presents the SENDURO®MEMS for fully automatic metrology quality control in sensor and MEMS production. The SENDURO®MEMS provides reliable and precise measurement of thin film stacks, using spectroscopic reflectometry and ellipsometry.

Customized Measurement Equipment
The SENDURO®MEMS equipped with reflectometer is for fast thin film measurement. Combined with a spectroscopic ellipsometer measurements of film thickness and optical constants, and the analysis of multi-layer stacks are featured. The SENDURO®MEMS can be configured with μ-spot measurements in reflectometry and ellipsometry, and pattern recognition which provides the accurate measurement location. All measurements can be combined with the edge grip technology.

Highest flexibility and accuracy in terms of thin film analysis is provided by combination of spectroscopic reflectometry and spectroscopic ellipsometry based on SENTECH most accurate Step Scan Analyzer measurement mode. It is operated by the SENTECH comprehensive SpectraRay/4 software. The SECS/GEM software interface option supports the communication between factory host (MES) and production equipment (SENDURO®MEMS).

Automated wafer handling
The SENDURO®MEMS allows the handling of double-sided wafers. Edge grip wafer handling with small edge exclusion is optionally available for 100 mm, 150 mm, and 200 mm wafers.

The tool is equipped with robot and pre-aligner for automated wafer loading using cassettes.

Single point and multiple point measurements are supported by up to 200 mm x-y mapping. Pattern recognition is available for microspot spectroscopic ellipsometry (100 x 100 μm2) and microspot reflectometry (80 μm2).

Measurement of large variety of materials
The SENDURO®MEMS is a fully automated thin film metrology tool for measurement of a large variety of materials such as silicon oxide, silicon nitride, silicon oxynitride; amorphous silicon, polysilicon; photoresist, polyimide; thin metal films of Al, Pt, Cr and conductive films of TiN, TaN, TCO and ITO; single films and layer stacks of these materials on silicon wafers, silicon-on insulator substrates, silicon membranes, GaN on silicon, SiC, and more, used in MEMS and sensor production.

The SENDURO®MEMS is perfectly suited to optimize measurement speed, accuracy, and spot size by combination of ellipsometry and reflectometry in one tool. For MEMS and sensor fabrication industry this system is a cost effective asset.

DISCO Presented With The Supplier Continuous Quality Improvement (SCQI) Award By Intel Corporation
Semiconductor Memory Adoption To Be Augmented By Penetration Of Smartphones Across The Globe
Pfeiffer Vacuum Introduces Extremely Quiet, Dry Pumps
Semiconductor Memory Market Worth Over USD 250 Bn By 2026
Security Lithography Advances To Thwart IC Counterfeiting
ACM Research Launches Stress-Free Polishing Tool For Advanced Packaging Applications; Delivers First Tool To Leading Chinese OSAT
Park Systems Announces $1 Million Dollar Nano Research Grant Fund
Mycronic Receives Order For An SLX Mask Writer
A Burgeoning Secondary SME Market Is Inevitable
UltraSoC Collaborates With PDF Solutions To Prevent In-life Product Failures
Imec Demonstrates 24 Nanometer Pitch Lines With Single Exposure EUV Lithography
ASYMTEK And DIMA Products Now Entirely Represented In Switzerland By Neutec Electronic AG
Critical Manufacturing Recognized By Gartner
Infineon Withdraws Outlook For FY20
Semiconductor Manufacturing: Achieving Water Authority Compliance
Picosun Delivers Multiple Production ALD Systems To Asia
Picosun Reinforces Local Operations During The COVID-19 Epidemic
High-end Inertial Sensors: At The Dawn Of A Mass-adoption?
ISRA VISION Forms A Strategic Partnership With Atlas Copco
EV Group Establishes Heterogeneous Integration Competence Center
GLOBALFOUNDRIES And GlobalWafers Sign MOU
50th Hollow Cathode Gas Plasma Source Ordered From Meaglow
Efinix’s Trion FPGA Silicon Platform Expands Into Europe
Particle Measuring Systems Releases 20 Nm Syringe Sampler

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}