+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Scalable solution for electrical fault isolation of semiconductor devices

News

With the new Thermo Scientific Meridian S inverted Static Optical Fault Isolation (OFI) solution, semiconductor failure analysis labs can future-proof their operations with a fully scalable solution. Semiconductor failure analysis engineers and technicians can isolate electrical faults that cause semiconductor devices to fail at end-of-line test. These defects, such as metal shorts, opens, and transistor-level leakage, are localized in the failure analysis workflow to troubleshoot process or design failures and increase overall device manufacturing yield. This all-in-one system includes both photon emission and static laser stimulation applications, and is a cost-effective, high-sensitivity solution for localizing electrical failures in semiconductor devices.

The addition of Meridian S also provides semiconductor manufacturers with a reliable static OFI tool that delivers performance. Multiple upgrade paths are available, bringing the industry-leading capabilities of dynamic OFI and high sensitivity emission as customers’ lab needs develop.

“Meridian S offers high optical resolution and enhanced sensitivity with a robust upgrade path for future expansion, all in a single tool,” said Debbora Ahlgren, senior director, materials and structural analysis, Thermo Fisher Scientific. “The result is a high return on investment and a concrete roadmap as customers increase their OFI capabilities.”

Meridian S offers several benefits designed to maximize performance:

• High-sensitivity probing: Meridian S includes FDx with Active Probe, a next-generation Static Laser Simulation (SLS) amplifier for applications such as Optical Beam Induced Resistance Change (OBIRCH) failure analysis.

• Static OFI analysis on a broader range of devices and package types: Meridian S offers both topside probing for flip chip packages and wafer pieces as well as backside probing for conventionally packaged devices.

• Easy-to-use software: Meridian S is optimized to work with the proven Sierra software platform for enhanced ease of use and offers a number of features, including Live Emission mode which allows users to view photon emission signatures emerge in real-time.

• Laser marker option for physical markings of fault locations: Meridian S provides a laser marker option with an accuracy level better than 2 microns.

Meridian S will ship in the fourth quarter of 2019. More information can be found at: Thermofisher.com/MeridianS.


Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: