News Article

ACM Research Launches 18-Chamber Single-Wafer Cleaning Tool


ACM Research, Inc, a supplier of
wafer cleaning technologies for advanced semiconductor devices,has announced
from SEMICON China its Ultra C VI single wafer tool, the newest addition to its
line of Ultra C cleaning systems. The Ultra C VI targets high-throughput
cleaning of dynamic random-access memory (DRAM) and 3D NAND Flash devices to
support increased production scale. Building on ACM's proven multi-chamber
technology, the new tool features 18 chambers, representing a 50-percent
expansion on the throughput and 12 chambers included in the Ultra C V system,
with the same tool width and only slightly larger in length to allow for
integration into existing production lines.

“Although memory devices are increasing in complexity, they
still have the same high throughput requirements,” said ACM's president and CEO
Dr. David Wang. “Additional cleaning chambers enable memory device makers to
support extra processing steps and more sophisticated drying technology, while
maintaining or reducing production cycle time. We see an 18-chamber
configuration as the sweet spot for this application. Compared to systems with
higher chamber counts, the Ultra C VI provides a better balance for wafer-per-hour
requirements and factory-automation matching.”

The Ultra C VI performs single-wafer cleaning for advanced
DRAM devices of 1y nm and beyond, as well as advanced 3D NAND devices with 128
stacked layers and above. It can be used for a variety of front-end-of-line
(FEOL) and back-end-of-line (BEOL) processes, depending on the application and
the chemistries involved, such as BEOL polymer removal, tungsten- or
copper-loop post-cleans, pre-deposition cleans, post-etch and post-chemical
mechanical planarization (CMP) cleaning, deep-trench/via cleans, and RCA
standard cleans.

Multiple chemical combinations can be used during cleaning,
including standard clean (SC1, SC2), hydrofluoric acid (HF), ozonated deionized
water (DI-O3), diluted sulfuric peroxide mixture (DSP, DSP+), solvent cleaner,
or other process chemicals. Up to two chemicals can be reclaimed and reused,
which helps reduce the cost of consumables and overall cost of ownership. The
Ultra C VI can accommodate optional physical assistant cleaning methods, such
as dual-fluid N2 spray cleaning or ACM's proprietary SAPS and TEBO megasonic
cleaning technologies. It also offers an isopropyl alcohol (IPA) drying
function that can be applied to patterned wafers with high aspect ratios.
Moreover, as it fits within the same width as ACM's existing tools, this tool
helps improve fab utilization and further contributes to lower cost of

ACM plans to deliver the Ultra C VI tool to a leading memory
manufacturer for evaluation and qualification early in the third quarter of

To learn more about the complete line of ACM cleaning
solutions, including the new Ultra C VI system, please visit ACM in Booth E5223
at SEMICON China, being held June 27-29, 2020, at Shanghai New International
Expo Center; or contact the ACM representative for your region listed below.

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