Info
Info
News Article

Park Systems Introduces New Automated AFM For Large Panel Displays

News

Park Systems has announced its new Park NX-TSH, an automated tip scan head atomic force microscope (AFM) for large sample analysis over 300mm. The Park NX-TSH features conductive atomic force microscopy for electric defect analysis and integrates a micro probe station. The United States introduction has been made in conjunction with SEMICON West where Park Systems has a virtual display. The company hosted a live demo of the system at SEMICON China June 27-29.

The tip scanning head (TSH) is an automated moving tip head for industrial AFM measurements on large samples over 300 mm developed for OLED, LCD, and photonics for large sample analysis. The automated TSH moves on an air-bearing stage and combines x, y, and z scanners moving directly to the desired point on the substrate.

“The Park NX-TSH was developed specifically for manufacturers setting up fabs to produce next-generation flat panel displays with the objective of overcoming the 300mm size threshold limit,” stated Keibock Lee, Park Systems President. “Using conductive AFM, the Park NX-TSH measures the sample surface with an optional probe station that contacts the sample surface and provides current into small devices or chips.”

The automated Park NX-TSH systems overcomes nano metrology challenges with a gantry style tip scanner system that moves directly to a place on the sample and produces high resolution images of the roughness measurement, step height measurement, critical dimension measurement & sidewall measurement.

The Park NX-TSH can scan up to 100 µm x 100 μm (x-y direction) and 15 μm in the z direction; it has a flexible chuck to accommodate large and heavy samples. As the demand for larger flat panel displays increases to 65 inches, 75 inches and more, the Park NX-TSH overcomes these size challenges with its automated gantry style tip scanning system.

“Park Systems has scaled up their AFM tools for Gen10+ and all large flat panel displays using the Park NX-TSH (tip scanning head) system, and is the only automated tip scan head for large sample analysis over 300mm,” adds Lee.

In operation, samples are fixed on a chuck within the NX-TSH system, which overcomes size and weight challenges that other systems cannot address. The tip scanning head (attached to the gantry) moves to measurement positions on the surface of the sample according to predetermined scan programmes.

According to Park Systems, atomic force microscopy is the most accurate, non-destructive method of measuring samples at nanoscale. By utilizing the Park NX-TSH, reliable, high resolution AFM images can be obtained for OLEDs, LCDs, photomasks, and more.

Visit the Park Systems virtual booth at SEMICON West and see the Park NX-TSH video.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
ITRI And DuPont Inaugurate Semiconductor Materials Lab
Cadence Announces $5M Endowment To Advance Research
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
EV Group Establishes State-of-the-art Customer Training Facility
TEL Introduces Episode UL As The Next Generation Etch Platform
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating
SUSS MicroTec Opens New Production Facility In Taiwan
Changes In The Management Board Of 3D-Micromac AG
K-Space Offers A New Accessory For Their In Situ Metrology Tools
New Plant To Manufacture Graphene Electronics
ASML Reports €14.0 Billion Net Sales
AP&S Expands Management At Beginning Of 2021
Will Future Soldiers Be Made Of Semiconductor?
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
Panasonic Microelectronics Web Seminar
Onto Innovation Announces New Inspection Platform
DISCO's Completion Of New Building At Nagano Works Chino Plant
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
Siemens And ASE Enable Next-generation High Density Advanced Package Designs

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event