The semiconductor division of SINGULUS TECHNOLOGIES AG has been awarded an order for a TIMARIS type cluster tool for vacuum deposition on 300 mm wafers. The order in a mid-single-digit range was placed by one of the largest semiconductor foundries of the world and is intended for mass production of integrated inductors.

“We are pleased to convince an additional leading semiconductor foundry with our TIMARIS vacuum deposition platform. Paramount this success was our competence in process development, reliability and productivity of our cluster tools in a state-of-the-art 300 mm Fab”, comments Dr. Stefan Rinck, CEO of SINGULUS TECHNOLOGIES.

Integrated inductors enable highly-integrated voltage regulators. Thin-film transformers convert higher supply voltages to lower operating voltages directly in the chip/package. This has two primary benefits: The considerably smaller footprint allows higher integration in mobile devices. Datacenter benefit from reduced ohmic losses as transformation to higher current takes place at the consumer. SINGULUS TECHNOLOGIES thus enables further integration in the semiconductor industry and the reduction of energy consumption.

The vacuum deposition cluster tools of the TIMARIS type have modular design and can be equipped with various deposition and auxiliary modules. Amongst others, they include modules for sputtering, which can be equipped with several cathodes and operate in ultra-high vacuum of 10^-9 Torr. Furthermore, they seamlessly integrate into the host system of modern, fully automated 300 mm fabs.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

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