ASML Acquisition Of Berliner Glas Group Completed
In July 2020 ASML, one of the world's leading manufacturers of chipmaking equipment announced that it agreed to acquire Berliner Glas Group, including all subsidiaries. Today, both companies announce the successful closing of this transaction.
The current management team of the Berliner Glas Group will continue to run the company and will be complemented with ASML management. The contacts for customers and suppliers will remain the same.
Dr Andreas Nitze, CEO of the Berliner Glas Group: “We are very pleased that we were able to close this transaction so quickly. Today marks a new beginning in the corporate history of the Berliner Glas Group - from a family-owned international company to a global corporation. Since we have been working with ASML for a long time, we are convinced that we will fit very well into the ASML organization. The corporate cultures and values of our companies are very similar and compatible. We will bundle our competencies and resources and continue the success story together.”
Peter Wennink, President & CEO of ASML: “Today, we welcome 1,600 new colleagues into ASML so this is an exciting day for us as well. We have enjoyed working with Berliner Glas in the past and we value their innovation. We look forward to strengthening this collaboration further. In the coming months we will work closely together to get to know each other even better and to plan for the future.”
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
and will feature online
versions of the market-leading physical events: CS International
and PIC International
PLUS a brand new Silicon Semiconductor International
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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