Info
Info
News Article

ITRI And DuPont Inaugurate Semiconductor Materials Lab

News

Taiwanese lab will combine ITRI’s semiconductor-related technical strength and DuPont’s expertise in materials

Industrial Technology Research Institute (ITRI) and DuPont Electronics & Imaging have celebrated the opening of a new semiconductor materials laboratory in Hsinchu, Taiwan.

DuPont established the laboratory to stay close to the semiconductor industry in Taiwan. DuPont will conduct, in collaboration with ITRI, semiconductor material research, development and enhancement, and accelerate pilot testing and commercial viability to support DuPont's customers as they pursue the next generation of semiconductors in Taiwan.

The evolution of 5G and Artificial Intelligence (AI) has spurred development of key technologies for the next generation of semiconductors, including materials to support heterogeneous integration, advanced manufacturing processes, and high-end packaging. Taiwan plays a leading role in the semiconductor industry and has an integrated semiconductor supply chain.

Chih-I Wu, VP and general director of ITRI's Electronic and Optoelectronic System Research Laboratories, stressed that ITRI has long invested in semiconductor research and development and has a solid foundation in the fields of electronics and optoelectronics, advanced packaging processes, chemistry and materials. With the support from AI on Chip Program of Department of Industrial Technology (DoIT), Ministry of Economic Affairs (MOEA), ITRI will expand investment in advanced equipment and technology, heterogeneous integrated packaging experiment platforms and diversified design, manufacturing processes and prototype production services.

“Bringing together ITRI's semiconductor-related technical strength and DuPont's expertise in materials, this laboratory in ITRI's vicinity will enable closer exchanges between the two organisations to bring more innovative solutions and meet the immediate needs of Taiwan's semiconductor and IC substrate industries,” he said.

“DuPont has been conducting business in Taiwan for more than 50 years and has grown alongside Taiwan's industrial development, especially in the electronics industry. Our investment in semiconductor technology and manufacturing centres in Taiwan serves as our hub in Asia Pacific to promote advanced semiconductor technologies globally,” said Dennis Chen, DuPont Taiwan president. “Over the years, we have made efforts in strengthening technological breakthroughs, terminal applications and supporting the strategic technology roadmap in Taiwan. The inauguration of this laboratory marks another important milestone as we continue to enhance innovation and R&D capabilities in Taiwan.”

Added Rob Kavanagh, global business director, DuPont Advanced Packaging Technologies: "DuPont is committed to the development of advanced materials in support of the increasingly complex packaging technologies. We have seen positive outcomes from our past collaboration with ITRI and look forward to further leveraging each other's competencies and experience for our customers and Taiwan's semiconductor industry.”

Brewer Science’s Newly Launched Smart Devices Will Be Displayed At CES
CEA-Leti Breakthrough For Next-Generation Memories And RRAM Energy-Storage
BASF And Entegris Sign Agreement On Sale
ULVAC Expands Process Capability
SiLC Rolls Out Chip-Integrated FMCW LiDAR Sensor
Kurt J. Lesker Acquires KDF Electronics & Vacuum Services
Brewer Science Presents Best Practices For Workplace Culture At SEMICON West
Edwards Launches New Cryopump
Park Systems Combines AFM With White Light Interferometry
EV GROUP Brings High-speed High-precision Metrology To 3D Heterogeneous Integration
The All-round Smart Proximity Sensor Chip
3D-Micromac AG Appoints Marko Gerlach Chief Financial Officer
Detecting And Classifying Defects In Semiconductor Manufacturing Via Atomic Force Microscopy
CEA-Leti Unveils Navigation-Grade Gyroscopes
3D-Micromac AG Appoints Hartmut Schubert To Chief Technology Officer
Are You Facing Decisions And Challenges With Interconnects, Pattern Transfer, 3D Scaling And Atomic Scale Processing And Integration?
ALD Is Taking Off In More-than-Moore Applications
Mycronic Receives Order For An SLX Mask Writer
NTU Singapore Launches Quantum Science And Engineering Centre
SUSS MicroTec And SET To Develop Equipment Solution For 3D Chip Integration
ERS Electronic Appoints Mark Wachter As Chief Financial Officer
YES Partners With Osiris For Edge Film Removal Technology
Siemens Collaborates With PDF Solutions To Boost IC Yield And Speed Time
Imec Demonstrates Significant Performance Gains Utilizing Backside 3D SOC Interconnects

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
Live Event