Info
Info
News Article

Thermo Scientific Offers A Leap Forward For Advanced Materials Characterization

News

Thermo Fisher Scientific has unveiled the Thermo Scientific Spectra Ultra, a next-generation scanning transmission electron microscope ((S)TEM) that offers structural and chemical insight on a wide range of materials at atomic-scale resolution.

The new Spectra Ultra provides flexibility to optimize conditions for advanced imaging and analysis in minutes versus hours. To fast-track materials research and improve throughput, users can now rapidly adjust accelerating voltage with high stability. This enables investigation of an extended range of samples, minimizes beam damage and greatly reduces tool optimization overhead.

Spectra Ultra includes a new energy-dispersive X-Ray (EDX) analysis system, the Thermo Scientific Ultra-X, with the largest detector area available in a commercially released (S)TEM. Combined with the new objective lens design, the EDX detector architecture makes it possible to capture X-Rays twice as fast as currently available commercial solutions, allowing the analysis of more beam-sensitive materials and samples with previously undetectably low concentrations of trace elements.

Spectra Ultra builds on the advancements already available in the Thermo Scientific Themis and Spectra platforms, removing complexity so users can obtain quality data at high resolutions.

"The Spectra Ultra, configured with Ultra-X, changes the game for both materials science researchers and semiconductor manufacturers. It can dramatically reduce beam damage by swiftly applying different accelerating voltages, and users will be able to detect light elements with even lower concentration," said Rosy Lee, vice president of materials science at Thermo Fisher. "In addition, users can quickly image and analyze new and improved materials at increased resolutions, compared to other commercially available solutions."

"As semiconductor manufacturers approach the physical limits of current process technologies, they are incrementally expanding their use of elements across the periodic table to find solutions that deliver the power, efficiency and performance required for emerging applications," said Glyn Davies, vice president of semiconductor at Thermo Fisher. "The Spectra Ultra provides industry-leading (S)TEM analysis and characterization capabilities to assist them in meeting the demands for advanced material solutions."

New features of the Spectra Ultra (S)TEM include:

  • A constant power lens and optics design enabling users to rapidly tune the instrument to the optimal voltage for their job.
  • The Ultra-X EDX detector which halves the EDX mapping time and elemental concentrations previously undetectable on a commercially released system.
  • Increased imaging sensitivity with the ability to measure single electrons, enabling the high-resolution characterization of soft materials.
  • Atomic-level analysis for the fundamental development and improvement of materials.
  • The optional super high brightness X-CFEG (Cold FEG) emitter that, when combined with the Spectra Ultra, delivers industry-leading imaging contrast and analytical capabilities.

These breakthrough technologies expand research possibilities for materials scientists. The minimal electron dose and time needed for EDX enables atomic-level analysis of beam-sensitive specimens. The flexibility to optimize imaging and analytical conditions in a single experiment means faster 3D characterization of both hard and soft materials within one sample, accelerating product development research. With increased throughput and detector collection efficiency, multiuser facilities can offer greater accessibility for a broad variety of projects.

The easy-to-use Spectra Ultra enables semiconductor researchers to analyze devices and structures quickly and more reliably. With the most powerful commercially released EDX system and instant switching of accelerating voltages, the Spectra Ultra facilitates the development of new memory and logic devices at advanced technology nodes.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
Brewer Science Expands Capabilities: Smart Devices & Printed Electronics Foundry
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
Superconducting Chips To Scale Up Quantum Computers And Boost Supercomputers
Quantum Computing Breakthrough Shows Blueprint For Scalable Future
Brewer Science Recognized As Outstanding Exporter
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips
Tokyo Electron Announces PICP Pro Plasma Etch Systems
Panasonic Microelectronics Web Seminar
Cadence Unveils Next-Generation Palladium Z2 And Protium X2 Systems
Thermo Scientific Offers A Leap Forward For Advanced Materials Characterization
Picosun Trusts In Augmented Reality For Refined Customer Support
EMD Performance Materials Announces Further Investment
Hamamatsu Develops Rapid Micro-LED Inspection Tool
AP Memory And Ambiq Partner
Picosun Group Demonstrates Strong Growth In 2020
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
Merck KGaA Silicon Valley Innovation Hub To Intermolecular Site
Cast Aluminum Solutions Launches Industrial Heater
Imec Demonstrates 18nm Pitch Line/Space Patterning
Siemens And ASE Introduce Enablement Technologies For High Density Advanced Package Designs
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
Xilinx Expands Into New Applications
Macronix Provides Advanced Flash Memory To STMicro
Applied Materials Introduces New Playbook For Process Control

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event