News Article
Rudolph Receives Customer Approval of System for Advanced Packaging Applications
Rudolph Technologies, Inc., a suppler to the semiconductor, FPD, LED and solar industries, has announced that the first of its new JetStep Photolithographic Systems has been sold to a leading provider of advanced semiconductor packaging and test services.
The system is being used for wafer level packaging processes where its flexible substrate handling and unique optical capabilities deliver valuable benefits. As noted in Rudolph's release announcing its entrance into the back-end lithography market, the company's inaugural JetStep System was shipped and installed in the 2012 fourth quarter in Asia. The system has received acceptance and was put in production during the 2013 first quarter.
Mayson Brooks, senior vice president and general manager of Rudolph's Advanced Packaging Lithography Business Unit, noted, "Adoption of Rudolph's revolutionary 2X reduction system confirms our belief that the unique capabilities of the JetStep System are the best available solution for the highly demanding lithography needs specific to advanced packaging processes. These needs, such as the ability to accommodate warped-wafer substrates, are markedly different from front-end lithography. In addition, the JetStep System's optical configuration"”with its large field of view, long working distance, on-the-fly autofocus, programmable field apertures and automatic magnification correction"”delivers unique performance and throughput advantages for these leading-edge applications."
Elvino da Silveira, chief technical officer of the Lithography Systems Group, added, "As resolution, overlay and many other technical specifications become tighter and more sophisticated in advanced packaging processes, back-end manufacturers are choosing to move from aligners to steppers to meet these requirements.
The JetStep System is a 2X reduction stepper with a large field of view (52mm x 66mm), and is unique in its ability to handle a wide spectrum of substrate sizes and warped wafers which may include glass interposers, panels of any shape and size, and standard and reconstituted wafers from 300mm to next-generation 450mm. An onboard, automated reticle library enhances throughput and ease-of-use. The JetStep stepper is part of a unique total lithography solution which integrates the stepper with Rudolph's existing systems and software, including the NSX Series inspection tool for CD and overlay measurements; ProcessWORKS software for run-to-run, closed-loop process control; ARTIST software for fault detection and classification; Discover software for fabwide yield management; and the S3000S product family for resist thickness metrology."
Paul F. McLaughlin, chairman and chief executive officer, noted, "Acceptance and the initial sale of the JetStep System is a milestone for Rudolph, validating the commercialization of our innovative 2X stepper total lithography solution which boasts industry leading cost-of-ownership benefits from a single supplier.
"Advanced packaging is in the early stages of dynamic growth and is a critical driver of mobile connectivity and, therefore, a critical driver for Rudolph. Consumer device demand is driving the need for new packaging technologies for 2.5D and 3D multi-die integration. These and other advanced wafer level packages now in development at leading IDMs, foundries and OSATs require a more sophisticated stepper lithography solution. The JetStep System's flexible substrate handling and large field of view provide critical enablers for those processes." Mr. McLaughlin concluded, "Semiconductor device manufacturers and OSAT providers need partners that deliver leading edge, back-end technology along with complete process solutions. Rudolph is a process control partner that can deliver improved production systems for advanced packaging applications and provide a flexible stepper capable of delivering unique solutions that meet their advanced requirements. The Rudolph JetStep 2X Solution is positioned not only for today's leading edge packages, but also for future advanced packaging technology needs."
