+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

SUSS announce better than expected results for Q1, slightly down on 2012

News

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has published its report for the first quarter of the fiscal year 2013.
 
Order intake in the first three months 2013 developed positively and came in at EUR 34.9 million, which is at the upper end of guidance of EUR 25 - 35 million (previous year: EUR 39.0 million). 

Sales amounted to EUR 30.1 million, which is 3.5 percent below the previous year's level of EUR 31.2 million. The Order backlog amounted to EUR 91.5 million (previous year: EUR 99.8 million).

The Lithography segment posted a 13 percent decrease in sales to EUR 18.6 million (previous year: EUR 21.5 million) during the quarter under review. Sales in the Substrate Bonder division declined from EUR 4.3 million in Q1 2012 to EUR 3.1 million in Q1 2013. The Photomask Equipment division recorded higher sales of EUR 7.5 million, after EUR 4.5 million in Q1 2012.

The management board of SUSS MicroTec has decided to focus permanent bonding on MEMS and LED applications to address the unsatisfying earnings level of this product line. With this step SUSS MicroTec takes into account the technological advancement of the product portfolio and the market developments of the recent years. In connection with these measures a non-cash adjustment of EUR 6.8 million in the second quarter 2013 will be necessary. The write-offs are on capitalized development costs, which originate from the years prior to 2008, as well as on no longer needed demonstration tools and inventories. The future growth of the Substrate Bonder division will mainly be driven by the product line Temporary Bonding which has been successfully established in the market. The sales contribution of the Permanent Bonding product line will for the time being remain at the level of the previous year. With these changes the Substrate Bonder division of SUSS MicroTec is well positioned to benefit from the expected growth in the target markets 3D IC, MEMS and LED in the years to come.

Cash and interest bearing securities amounted to EUR 29.3 million at the end of the first quarter. Net liquidity amounted to EUR 25.1 million (March 31, 2012: EUR 38.5 million). The free cash flow for the first quarter 2013, before effects of M&A activities and the purchase or sale of interest bearing securities, amounted to EUR -7.2 million (previous year's quarter: EUR 0.3 Million).

Outlook
Management reiterates the sales guidance of approximately EUR 150 million for the fiscal year 2013. Due to the write-offs, SUSS MicroTec now expects a negative EBIT in the mid-to-high single digit million Euro range for the fiscal year 2013. For the second quarter of the fiscal year 2013 the company expects orders to come in between EUR 30 - 40 million.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: