Yole: 2.5D, 3DIC and TSV patent landscape up & coming
Yole Développement has released a 2.5D, 3DIC and TSV Interconnect Patent Investigation report.
Yole's investigation provides a statistical analysis of existing IP to give a landscape overview together with an in-depth investigation on 5 player portfolios selected by the analyst.
The report says very young patent landscape is dominated by 10 companies.
For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened.
52 percent of the families have been classified as relevant and further studied.
"The in depth analysis quickly revealed that the overall patent landscape was pretty young with 82 percent of patents filed since 2006. Actually about 260 players are involved in 3DIC technology while the top 10 assignees represents 48% of patents filed in the 3DIC domain!," explains Lionel Cadix, Technology & Market Analyst, Advanced Packaging, at Yole Développement.
Yole selected 5 companies from these 10 most active players to focus on and lead an accurate analysis of their patent portfolios.
The market research firm found 4 main types of business models among the top 10 assignees involved in this mutating middle end area:
These include
Foundries and IDMs :IBM, Samsung, Intel
OSATs: STATS ChipPAC, Amkor
Memory IDM/Foundries: Micron, SK Hynix, Elpida
Research centre: ITRI
It is also interesting to notice that the USA is the early player increasingly involved in 3DIC since 1969.And China and Korea are new players since 2005. In the patent portfolio of the top 10 3DIC assignees are Intel, Samsung, Micron, IBM and TSMC.
