+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Renesas and imec pioneer 28nm RF CMOS

News

Renesas Electronics Corporation and imec have unveiled the world's first multi-standard radio frequency (RF) receiver in 28nm CMOS technology, and a 28nm analogue-to-digital converter (ADC).

The device, targeting wide-bandwidth standards such as LTE-advanced and next-generation WiFi was  revealed at this week's VLSI circuits Symposium in Kyoto, which took place from June 12th and 14th.

Imec specialises in developing reconfigurable RF solutions, high-speed/low-power ADCs and new approaches to digitise future RF architectures and minimise antenna interface requirements. The company combines innovative design with advanced chip technology (28nm and beyond) to develop small, low-cost, energy-efficient RF solutions with competitive performance.

Imec aims at developing solutions that cover all key broadband communication standards including emerging cellular and connectivity standards such as LTE advanced and next-generation WiFi.

The 28nm receiver is a linear software-defined radio (SDR) operating from 400MHz up to 6GHz and supporting reconfigurable RF channel bandwidths up to 100MHz.

Through novel design and architecture techniques, the receiver operates at a low standard supply of 0.9V, while maintaining +5dBm of out-of-band IIP3 and tolerating 0dBm blockers. It achieves noise figures down to 1.8dB, occupies an active area of 0.6mm2, and consumes less than 40mW.

The ADC is a 410MS/s dynamic 11bit pipelined SAR ADC in 28nm CMOS. It achieves a peak Signal-to-Noise Distortion Ratio (SNDR) of 59.8dB at 410MS/s with a power consumption of 2 mW. By combining novel digital calibration techniques with a new ADC architecture, an excellent energy efficiency was achieved. The ADC, including an on-chip calibration engine, occupies an active area of 0.11mm2.

"High-volume consumer devices require advanced chip technology that is cost-effective," states Joris Van Driessche, program manager of reconfigurable radios at imec. "Along with our partner, Renesas, we are thrilled to continue to offer innovative solutions to the market. Our 28nm wireless receiver brings the electronics industry closer to the development and adoption of next-generation wireless devices."

"High level integration and low power are strongly required for recent wireless transceivers. There is every possibility of creating epoch-making architecture for RF and analogue cores by using fine CMOS technology," adds Hisayasu Sato, Senior Manager of 2nd Analogue Core Development Department, Core Technology Business Division, 1st Solution Business Unit, Renesas Electronics Corporation.

He continues,"Through the collaboration with imec, we have been developing cutting-edge technologies. We continue to supply competitive IP cores and solutions to our customers."

 

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: