Dow awarded for bonding for 2.5D and 3D ICs
Dow Corning has won a 3D InCites Award for its innovative new temporary bonding solution for 2.5D and 3D IC packaging applications.
Winning the Materials category, Dow Corning accepted the award at a ceremony held during last week's SEMICON West 2013 in San Francisco.
3D InCites, an online media resource promoting news, discussion and collaboration in 3D IC integration and 3D packaging technologies, established its award program in conjunction with TechSearch International, a semiconductor licensing and technology firm, to recognise achievements that advance the commercialisation of 2.5D and 3DIC technologies.
"Winning this award is a true honour, especially in the way it validates Dow Corning's intense and collaborative efforts to innovate the advanced materials technologies that support adoption of next-generation semiconductor packaging applications," says Andrew Ho, global industry director, Advanced Semiconductor Materials at Dow Corning.
"We deeply appreciate 3D InCites' recognition of our bi-layer Temporary Bonding Solution. Our solution adopts simple, room temperature bonding and debonding process and eliminates the need for specialised equipment for wafer pre-treatment in bonding or wafer post-treatment in debonding, thereby increasing the potential for higher throughput and a lower total cost of ownership."
Both 2.5D and 3D IC integration of packaging technologies offer significant potential for increasing bandwidth and reducing the form factor of microelectronic devices targeting next-generation communication devices, while improving their electrical and thermal performance.
Cost-effective temporary bonding solutions are a key enabler for this advanced technology by bonding today's ultra-thin active device wafers to thicker carrier wafers for subsequent wafer thinning and TSV fabrication.
A panel of nine independent 3D IC industry experts selected the winners based on innovation, the ability to solve a key industry problem, and cost-of-ownership. 3D InCites readers represented a tenth judge by voting for their favourite contender online. In addition to earning the favour of the industry judges, Dow Corning also won the public online vote.
Dow Corning builds on a long history of silicon-based innovation and collaboration in semiconductor packaging.