Brewer Science developments drive device fabrication forward
Brewer Science will present its latest innovative materials, processes, and wafer- processing equipment critical for enabling the advancement of lithography and 3-D IC integration at SEMICON Taiwan 2013 in Taipei, Taiwan.
The company will present five different topics at this event. Terry Brewer, founder and President of Brewer Science, will address materials-driven process development as a new mode for industry collaboration during his keynote speech at the SiP Global Summit 2013 3-D IC Technology Forum on September 5th, 2013.
Brewer explains, "For over 30 years, Brewer Science has consistently delivered many material solutions that have enabled the advancement of lithography processes and the creation of numerous generations of devices. Our proven materials-development expertise has widened process windows to prolong the productive lifetime of lithography equipment while lowering processing cost."
He continues, "Our 3-D IC and thin-wafer-handling materials are developed to have a similar impact by opening process windows, increasing equipment versatility, and lowering processing costs. By utilising our long experience with designing materials to increase process windows, it is possible to minimise capital investment and lower cost and time. Any wise investment in equipment sets must be carefully made based on process parameters and performance of the materials. The customer is best served when the customer and the material and equipment manufacturers work in tandem toward a solution."
Douglas Guerrero, Senior Technologist at Brewer Science, will discuss extending lithography with advanced materials during the Litho/Mask Technology Symposium on September 6th, 2013.
Guerrero explains, "With the continued delay of extreme ultraviolet (EUV) lithography, even more importance is placed on versatile material and process solutions designed to extend existing lithography technology. In this presentation, Brewer Science will discuss how material evolution has been able to extend lithography nodes in the past, present, and future. Recent material innovation for multilayer patterning for positive- and negative-tone development (PTD and NTD), directed self-assembly (DSA), and EUV lithography will be discussed."
Brewer Science will continue to share its innovative solutions at three TechXPOT sessions on the opening day of SEMICON Taiwan, September 4th, 2013. The firm's technology experts will address advanced lithography and 3-D IC materials, processes, and equipment solutions at the TechXPOT. Brewer Science will be at booth #539 during SEMICON Taiwan 2013.
