STATS ChipPAC and NTU to advance packaging
The partnership is targeted at finding breakthrough solutions for semiconductor wafer level and interconnect packaging technologies
STATS ChipPAC is collaborating with Nanyang Technological University (NTU) to generate breakthrough innovations in next generation packaging technologies.
STATS ChipPAC and NTU will work together to further the advancement in wafer level packaging and interconnect technologies, and accelerate research on new materials and manufacturing processes.
The partnership leverages the depth of resources in NTU's academic community and researchers, and STATS ChipPAC's experience in advanced semiconductor packaging technologies.
Based in Singapore, NTU has made substantial contributions to Singapore's drive for research and innovation.
This latest collaboration is in full alignment with STATS ChipPAC's ongoing commitment to Singapore as its global hub for advanced wafer level technology research and development, and Post Wafer fab Process for advanced mobile convergence devices.
"The semiconductor industry is evolving rapidly to meet the increasing device complexity and connectivity experience of today's electronic consumers. We are constantly seeking to expand our technology and manufacturing innovations in order to deliver differentiated solutions for our customers' next generation mobile convergence devices," says Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.
He adds, "We are excited to collaborate with NTU to harness semiconductor technologies that will drive the next generation of electronic devices,"
"NTU continues to be the choice partner for industry leading companies, a key trait of a world-class, research-intensive university. NTU has an established track record in research and development with key industry players and through such partnerships, we turn fundamental research into innovation, leading to commercialisation," comments Lim Jui, Chief Executive Officer, NTU Innovation.
"NTU's collaboration with STATS ChipPAC provides a great opportunity for NTU faculty and post graduates to leverage on our strong research culture and expertise to develop advanced packaging solutions. By continuing to work in tandem with industry leaders such as STATS ChipPAC, we can continue to be an important engine for innovation in Singapore," concludes Lim Jui.
