+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

SEMI: North American equipment industry in July book-to-bill ratio is 1.0

News

It looks like companies are investing in more semiconductor manufacturing equipment but this trend could easily change...

North America-based manufacturers of semiconductor equipment posted $1.27 billion in orders worldwide in July 2013 and a book-to-bill ratio of 1.00.

This is according to the July EMDS Book-to-Bill Report published by SEMI.  

A book-to-bill of 1.00 means that $100 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in July 2013 was $1.27 billion. The bookings figure is 4.6 percent lower than the final June 2013 level of $1.33 billion, and is 3.1 percent higher than the July 2012 order level of $1.23 billion.

The three-month average of worldwide billings in July 2013 was $1.27 billion. The billings figure is 4.6 percent higher than the final June 2013 level of $1.21 billion, and is 12.0 percent lower than the July 2012 billings level of $1.44 billion.

A table showing the figures reported by SEMI is below.



"Billings for new semiconductor manufacturing equipment continue to increase and the ratio has been at or above parity for the past seven months," says Denny McGuirk, president and CEO of SEMI.  "However, order data moderated slightly in the July report and we will look to the month ahead to determine if this reflects a trend change."

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

 


Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: