+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Toshiba Bluetooth IC is multi-tasking

News


Toshiba Corporation has launched the "TC35661SBG-501", a Bluetooth IC that is compliant with both Bluetooth Basic Rate and Bluetooth Low Energy communications.

Basic rate communication offers interoperability with a wide range of applications, such as smartphones, while low energy is a newly adopted Bluetooth V4.0 standard that reduces power consumption. Mass production is scheduled to start in November this year.

The two communication methods are not interoperable; they require different devices that match the communication method of the host applications. The new IC incorporates both the Serial Port Profile (SPP) that is used for Basic Rate communication and the Generic Attribute Profile (GATT) used for Low Energy communication. This realises a single device supporting two different communication methods. The product also contributes to efficient development.

Applications where the IC can be used include general wireless data communication, such as remote controllers, sensor devices, and toys; smartphone accessories, such as wireless headsets.

 
Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: