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Toshiba Launches New Embedded NAND Flash Memory Modules

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Toshiba Corporation and Toshiba America Electronic Components, Inc. have announced the launch of its new embedded NAND flash memory modules. The new modules integrate NAND chips fabricated with Toshiba's 19nm second generation process technology and are fully compliant with the latest e-MMCTM standard. Designed for application in a wide range of digital consumer products, the new modules are targeted to smartphones, tablet PCs and digital video cameras with production scheduled for November.

Demand continues to grow for large density NAND flash memory chips that support high resolution video and deliver enhanced storage.This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs. Toshiba is meeting this demand by reinforcing its line-up of high density memory products.

The company's new 32-gigabyte (GB) embedded device integrates four 64-Gigabit (equal to 8GB) NAND chips fabricated with Toshiba's cutting-edge 19nm second generation process technology and a dedicated controller into a small package measuring only 11.5 x 13 x 1.0mm. It is compliant with JEDEC e-MMC Version 5.0, published by JEDEC in September, and achieves a high read/write performance by applying the new HS400 high speed interface standard.

Toshiba's new line-up of single-package embedded NAND flash memories includes densities from 4GB to 128GB. Each device integrates a controller to manage basic control functions for NAND applications.

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