+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Toshiba shipping ¼ inch CMOS image sensor samples

News


Toshiba Corporation has commenced sample shipments of a VGA, ¼ inch CMOS image sensor, TCM5126GBA, for automotive view cameras.

The TCM5126GBA integrates a high dynamic range (HDR) function that reproduces high quality images of objects backlit by the sun and vehicle headlights.

The product has a small chip-size package (CSP) combined with through-silicon via (TSV) technology. TSV is the technology used to form electrical interconnects through a silicon die or wafer.

This reduces the size by 30 percent compared to the TCM5114PB and will contribute to the downsizing of view camera systems.

The sensor also incorporates a picture flip function that can flip output images horizontally and vertically, an on-screen display function that outputs preliminary-set parking guidelines together with the image, and a zoom function for use in rear view cameras in parking assist systems.

The built-in timer function sustains output of images when the gear stick is shifted from reverse to forward, allowing drivers to see a continuous movie when reversing into a parking space. The stand alone operation support (SAOS) function makes the sensor operate automatically when power is supplied without external microcontrollers, and will contribute to simplification of view camera systems.

Applications include automotive camera applications, such as rear view camera for parking assist systems, surround view systems and side view systems.

The device has a high dynamic range (HDR) and the adoption of the small chip-size package (CSP), contributes to system downsizing.

The TCM5126GBA has a variety of integrated functions supporting rear view camera systems: a picture flip function, on-screen display function, zoom function, timer function and SAOS function.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: