Yole and partners to host MEMS manufacturing seminar
Yole Développement and its partners SÜSS MicroTec and MEMS Industry Group have announced the Editorial Webcast, 'Manufacturing trends for consumer inertial MEMS,' which will take place on November 13th at 8:00 am PDT. The webcast will be hosted by the I-Micronews website.
During this live session, vision of the inertial MEMS industry, with a consumer focus and related manufacturing trends will be predicted. Specifically, Yole will give a market situation update and identify the major market drivers. Front-end and packaging evolutions will be discussed with SÜSS MicroTec and MEMS Industry Group.
"As MEMS inertial sensors become more prevalent in consumer applications there is a growing need to reduce package size and increase performance, while reducing overall production costs," comments Robert Hergert, SÜSS MicroTec.
MEMS inertial sensors will achieve 11 percent growth in 2013, becoming a $4.0 billion market. This industry will enjoy continuous expansion in the future, as motion sensor shipments are currently booming.
"Although we see ongoing adoption in automotive and an increasing interest in high-performance
applications, the strongest wafer shipments' driver is consumer applications," explains Laurent Robin, Activity Leader Inertial MEMS Devices & Technologies, Yole Développement.
To match these market drivers, component and die size are still being optimised, while combo approaches such as 6 and 9-axis sensors are becoming mainstream. Diverse technical solutions are being developed to optimise the front-end processing steps and the packaging of consumer inertial sensors.
Yole also observes that disruptive approaches are being considered for the next generation of sensors, with new detection principles and new designs such as piezo detection, MEMS-compatible magnetometers, integration of nano structures, and more.
During the webcast, a specific focus will be also applied to the most promising new approaches. Lastly, during the questions & answers sessions with the registrants, the our speakers will discuss the details of sensors recently released on the market and which are already implementing new technologies.
"Inertial sensors perform better when encapsulated in a controlled environment. This environment can be achieved through wafer level packaging. Several wafer bonding technologies can be used to achieve the hermitic environment required for high-performance inertial sensors," explains Robert Hergert, Senior Process Development Engineer, SÜSS MicroTec. Indeed, with its presentation, SÜSS MicroTec will explore the design constrains, advantages and disadvantages of several of these wafer bonding techniques.
According to SÜSS, 2.5D and 3D integration can further reduce the size and improve performance by allowing the stacking of sensors and CMOS circuitry. TSVs and interposers allow for a higher level of integration while reducing the overall size of the package. During the webcast, SÜSS MicroTec will present the advantages and challenges of implementing these techniques.
The company will also provide an update on the state of the art wafer level packaging and integration techniques. As these methods gain broader application in the market inertial MEMS sensors will see a marked decrease in size and cost with an increase in performance.
To attend the live event, you can register now on www.i-micronews.com/Webcase/MEMS.
The editorial webcast program is called, 'Manufacturing trends for consumer inertial MEMS,' and will take place on November 13th at 8:00 am PDT. (10.00 am ET, 4.00 pm GMT)
