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SEMI: ASMC 2014 abstract deadline extended

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SEMI has announced that the deadline for presenters to submit an abstract for the 25th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 28th

ASMC, which takes place from May 19th to 21st, 2014 in Saratoga Springs, New York, will feature technical presentations of more than 80 peer-reviewed manuscripts covering critical process technologies and fab productivity.

This year's event features a panel discussion on "25 Years of Semiconductor Manufacturing," moderated by Paul Werbaneth, 3D InCites, technical sessions on advanced semiconductor manufacturing, a keynote by TSMC, and tutorials on Silicon Photonics offered by Intel and Directed Self Assembly by IBM.

ASMC provides a venue for semiconductor industry professionals to network, learn and share knowledge on new and best-method semiconductor manufacturing practices and concepts. 

Selected speakers have the opportunity to present in front of IC Manufacturers, Equipment Manufacturers, Materials Suppliers, Chief Technology Officers, Operations Managers, Process Engineers, Product Managers and Academia.

Technical abstracts are due November 28th, 2013.

Technical abstracts should focus on the following technology areas:

    Advanced Metrology

    Advanced Equipment Processes and Materials

    Advanced Patterning / Design for Manufacturability

    Advanced Process Control

    Contamination Free Manufacturing

    Data Management and Data Mining Tools

    Defect Inspection and Reduction

    Discrete and Power Devices

    Enabling Technologies and Innovative Devices

    Equipment Reliability and Productivity Enhancements

    Factory Automation

    Green Factory

    Industrial Engineering

    Lean Manufacturing

    Packaging and Through Silicon Via

    Yield Enhancement/Learning

    Yield Methodologies

Complete descriptions of each topic and am author kit can be accessed at www.semi.org/en/node/46111. More information about the conference and the selection process can be obtained by emailing Margaret Kindling at mkindling@semi.org or on 1.202.393.5552.  

SEMI is encouraging papers co-authored between device manufacturers, equipment or materials suppliers, and/or academic institutions that demonstrate innovative, practical solutions for advancing semiconductor manufacturing. 

Abstracts may be submitted via the website http://semi.omnicms.com/semi/asmc2014/collection.cgi.


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