News Article
Brewer Science debonder chosen for RF components
The thermal slide, thin-wafer handling debonder is suited for use with thinned silicon and III-V compound semiconductor substrates
Brewer Science has announced the first commercial placement of its Cee 1300CSX thermal slide debonder.
This innovative debonder was purchased by an industry leader in the production of high-powered radio frequency (RF) components for use in wireless communications.
The Cee 1300CSX thermal debonder enables high-temperature slide-off debonding of thinned silicon and compound semiconductor substrates from a rigid carrier to allow further processing of delicate thinned wafers.
Cee 1300CSX thermal slide debonder
This debonding can be performed in a confidential laboratory setting without interrupting high-volume track production time and without investing large amounts of capital in additional automation.
"This commercial launch marks another strategic milestone in reducing the customer's cost of ownership for thin-wafer handling through Brewer Science's industry-leading equipment, temporary bonding materials, and process integration," says Justin Furse, Brewer Science Equipment Technology Strategist.
The Brewer Science Cee 1300CSX thermal debonder is claimed to deliver exceptional accuracy, interface capabilities, and process flexibility. The debonder enables precise control of the process temperature for thermally sensitive substrate materials. Customers can accelerate time to market of their new ultrathin wafer technologies with the enhanced Cee 1300CSX thermal debonder.
Significant improvements have been engineered into the new Cee 1300CSX debonder design.
In a compact footprint, the tool has precise lower platen z-position control and programmable electronic lift pins for loading and unloading. and substrate sizes can be varied. The Cee 1300 CSX also has a constant force mode, excess force sensing and data logging.
This innovative debonder was purchased by an industry leader in the production of high-powered radio frequency (RF) components for use in wireless communications.
The Cee 1300CSX thermal debonder enables high-temperature slide-off debonding of thinned silicon and compound semiconductor substrates from a rigid carrier to allow further processing of delicate thinned wafers.
Cee 1300CSX thermal slide debonder
This debonding can be performed in a confidential laboratory setting without interrupting high-volume track production time and without investing large amounts of capital in additional automation.
"This commercial launch marks another strategic milestone in reducing the customer's cost of ownership for thin-wafer handling through Brewer Science's industry-leading equipment, temporary bonding materials, and process integration," says Justin Furse, Brewer Science Equipment Technology Strategist.
The Brewer Science Cee 1300CSX thermal debonder is claimed to deliver exceptional accuracy, interface capabilities, and process flexibility. The debonder enables precise control of the process temperature for thermally sensitive substrate materials. Customers can accelerate time to market of their new ultrathin wafer technologies with the enhanced Cee 1300CSX thermal debonder.
Significant improvements have been engineered into the new Cee 1300CSX debonder design.
In a compact footprint, the tool has precise lower platen z-position control and programmable electronic lift pins for loading and unloading. and substrate sizes can be varied. The Cee 1300 CSX also has a constant force mode, excess force sensing and data logging.