+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Brewer Science debonder chosen for RF components

News
 
The thermal slide, thin-wafer handling debonder is suited for use with thinned silicon and III-V compound semiconductor substrates
Brewer Science has announced the first commercial placement of its Cee 1300CSX thermal slide debonder. 

This innovative debonder was purchased by an industry leader in the production of high-powered radio frequency (RF) components for use in wireless communications.

The Cee 1300CSX thermal debonder enables high-temperature slide-off debonding of thinned silicon and compound semiconductor substrates from a rigid carrier to allow further processing of delicate thinned wafers.



Cee 1300CSX thermal slide debonder


This debonding can be performed in a confidential laboratory setting without interrupting high-volume track production time and without investing large amounts of capital in additional automation.

"This commercial launch marks another strategic milestone in reducing the customer's cost of ownership for thin-wafer handling through Brewer Science's industry-leading equipment, temporary bonding materials, and process integration," says Justin Furse, Brewer Science Equipment Technology Strategist.

The Brewer Science Cee 1300CSX thermal debonder is claimed to deliver exceptional accuracy, interface capabilities, and process flexibility. The debonder enables precise control of the process temperature for thermally sensitive substrate materials. Customers can accelerate time to market of their new ultrathin wafer technologies with the enhanced Cee 1300CSX thermal debonder.

Significant improvements have been engineered into the new Cee 1300CSX debonder design.

In a compact footprint, the tool has precise lower platen z-position control and programmable electronic lift pins for loading and unloading. and substrate sizes can be varied. The Cee 1300 CSX also has a constant force mode, excess force sensing and data logging.


Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: