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Ziptronix and Tezzaron to accelerate 3D IC development

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The provider of patented, low-temperature direct bonding technology for 3D integration, has sold its 3D IC development lab to Tezzaron. Wholly owned subsidiary of Tezzaron, Novati Technologies will operate the facility

Ziptronix has signed an agreement with Tezzaron Semiconductor Corporation and Novati Technologies as a next step toward the acceleration of 3D integration.

As a key part of the agreement, Ziptronix sold its 3D IC development lab to Tezzaron, to be operated by Novati.

Due to widespread adoption of direct bonding in volume manufacturing, Ziptronix no longer has to dedicate its resources to supporting a lab for commercialisation of its patented ZiBond and DBI technologies.

Tezzaron will use the facility to support development and manufacturing of its rapidly growing advanced memory products. The deal includes a strategic agreement with Tezzaron that provides Ziptronix's lab customers continued access to the facility to perform their advanced development work.

"ZiBond has been in high-volume manufacturing for several years now and DBI is well on its way into production," says Dan Donabedian, CEO of Ziptronix. "Quite simply, as the market is now convinced of the value of our technology, our needs have shifted. As we look to accelerate 3D integration, our focus is increasingly on addressing the needs of the maturing and emerging markets that are adopting our technology via licensing."

Ziptronix's ZiBond technology is essential to the manufacture of the backside illumination (BSI) image sensors used in devices such as smartphones, tablets and digital cameras; applications for which it has seen wide-scale adoption in high-volume manufacturing.

At the same time, the company's DBI technology is rapidly maturing, with increasing adoption for advanced memory and integrated image sensor applications. Tezzaron and Novati have licensed Ziptronix technologies to strengthen their position in manufacturing semiconductor applications.

"This is truly a 'win-win' for all parties involved," says an ecstatic Tom Ayers, CEO of Tezzaron. "We get the facility we need for our technology development, fully equipped and staffed with seasoned personnel. At the same time, Ziptronix retains its ability to support its customers by ensuring they are able to continue their advanced development work in the lab."

Ziptronix offers patented technology for wafer- or die-level bonding. Its ZiBond® and DBI® technologies deliver the industry¹s most scalable, manufacturable and lowest total cost-of-ownership solutions for 3D stacking.

The company's intellectual property (IP) has been licensed for a variety of semiconductor applications including backside-illuminated (BSI) sensors, RF front ends, pico-projectors, memories and 3D integrated circuits.

 

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