Invensas and Tezzaron to deliver commercial 3D-IC products
Although complete high-quality 2.5D (Silicon Interposer) and 3D silicon devices can be manufactured, the final packaging flows are lacking
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. is partnering with Tezzaron Semiconductor Corporation, a pioneer and producer of 3D Integrated Circuit (3D-IC) semiconductor devices, in order to build a wide range of 3D-IC customer products.
"Today we can produce complete high-quality 2.5D (Silicon Interposer) and 3D silicon devices, but the final packaging flows are lacking," notes Robert Patti, CTO of Tezzaron. "Invensas' 3D-IC packaging expertise and existing pilot assembly line capability will enable us to ramp our unique products into full production. The Invensas combination of technology development and low volume manufacturing capabilities are unlike anything else available."
3D-IC technology involves the stacking of multiple Integrated Circuits with Through Silicon Vias (TSVs) into ultra dense, ultra high-performance, low-power products, using advanced semiconductor and semiconductor packaging processes.
3D-IC architecture is the fundamental building block of a broad range of next generation silicon solutions in Memory, Mobile SOC (System on Chip), RF (Radio Frequency), Image Sensor, MEMS, and Microprocessor products.
"We are delighted to take this next step in 3D-IC commercialization with Tezzaron," says Simon McElrea, president of Invensas. "3D-IC is finally at its strategic inflection point. We have developed unique assembly capability in our pilot line in San Jose, and have built a corresponding 3D-IC patent portfolio of over 500 assets to date. Tezzaron put 3D-IC on the map, and we are excited to work with them now to deliver commercial 3D-IC products to key customers."
