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SSEC wins two orders for thick-film removal tool

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The firm's WaferStorm thick-film remover selection by a major Asian foundry and US chip manufacturer validates the market shift towards single-wafer technology

Solid State Equipment LLC (SSEC) has secured two major wins for its WaferStorm platform at a leading foundry in Asia and a major US integrated device manufacturer (IDM).

In both cases, the systems were selected for their thick-film removal capabilities, which provide residue-free removal of difficult thick-film photoresists and dry films at a low cost of ownership.

Applications of the Waferstorm Thick-Film Remover are in wafer level packaging, 2.5D interposer and   3D ICs.

"As the industry moves to finer-pitch, smaller-feature micro-bumping processes for wafer-level packaging, removal of thick-film resists has become more of a challenge," says Erwan Le Roy, Marketing Vice President of SSEC. "We developed SSEC's process for thick-film removal with these next-generation challenges in mind. These significant tool wins substantiate SSEC's capability to provide advanced process solutions."

The WaferStorm Thick-Film Remover combines heated chemistries and proprietary soak-and-spray at high pressure for rapid and complete removal of stubborn thick-film residue. The soak step uses heated solvents throughout the buffer cycle time.

After softening the thick resist in the soak, the wafers are transferred to the single-wafer spray station where they are exposed to high-pressure fan sprays with heated solvents for rapid removal of thick-film residue. This combination ensures thorough removal and increased throughput.

Founded in 1965 and headquartered in Horsham, Pennsylvania, Solid State Equipment LLC (DBA SSEC) is a manufacturer of single-wafer wet processing equipment for the semiconductor industry.

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