+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

KCB unveils breakthrough envelope tracking technology

News

The firm's latest products are aimed at the emerging medium power RF transmitter market

KCB Signal Solutions has developed a new Envelope Tracking (ET) product line.

The series will be aimed at RF transmitters that must deal with complex waveforms, such as LTE, while transmitting between two to eight watts of average RF power.

"We were aware that multiple applications in commercial and military markets in this power class were highly interested in Envelope Tracking solutions but weren't being served by ET suppliers involved in smartphone solutions," comments KCB Signal Solutions President Dave McIntosh.

The product line has been designed from the beginning to be easily scalable due to the wide range of waveforms and output power levels it will address. The first two variants are designed to work with 28V or 48V RF Power transistors with other voltage options to come in future. The overall form factor is also a key factor for this product and the footprint should be two square inches or less depending on customer features.

McIntosh comments on the form factor by saying, "There are a number of critical circuits that had to be developed in order to meet our performance and form factor goals. One of the key circuits was developed through a collaboration with Analog Devices, Inc on their ADA4870 amplifier. ADI's ADA4870 is an exciting new device and its ability to efficiently work with our high-speed current and voltage waveforms is very impressive."

KCB Signal Solutions is delivering engineering samples to its alpha customers in 1Q 2014. Samples for the general market will become available in 3Q 2014 and volume production support will begin in 4Q 2014.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: