News Article
Craic develops thin film thickness software for sub-micron sampling
The company's FilmPro software is used with Craic Technologies microspectrometers to measure the thickness of thin films of microspot areas in both reflectance and transmission
Craic Technologies, an innovator of UV-visible-NIR microanalysis solutions, is introducing Craic FilmPro film thickness measurement software.
This software package is designed to plug-in to Craic Technology’s microspectrophotometers and their controlling Lambdafire software. Craic FilmPro allows the user to measure the thickness of thin films rapidly and non-destructively.
Able to analyse films of many materials on both transparent and opaque substrates, Craic FilmPro enables the user to determine thin film thickness on everything from semiconductors, MEMS devices, disk drives to flat panel displays. The software can be used in many different fields and in everything from research to industrial settings.
Film Thickness Mapping
"Many of our customers want to measure the thickness of thin films of smaller and smaller sampling areas for rapid quality control of their products. Craic FilmPro is a plug-in module that can be added to a Craic Technologies microspectrophotometer to enable this capability. This software was built in response to customer requests for a powerful, flexible film thickness tool that can measure sub-micron areas on both transparent and opaque substrates.Craic Technologies microspectrophotometers equipped with Craic FilmPro meets those needs" says Paul Martin, President.
The complete Craic Technologies microspot film thickness solution combines an advanced microspectrophotometer with the sophisticated Craic FilmPro software. This software is a plug-in module to Craic Technologies Lambdafire instrument control software.
It enables the user to measure film thickness by either transmission or reflectance of many types of materials and substrates.
Due to the flexibility of the Craic Technologies design, sampling areas can range from over 100 microns across to less than a micron. Designed for both research and the production environment, it incorporates a number of easily modified processing recipes, the ability to create new film recipes and sophisticated tools for analysing data.
With the addition of spectral mapping from Craic Technologies, the firm says film thickness maps of entire devices can be created.
This software package is designed to plug-in to Craic Technology’s microspectrophotometers and their controlling Lambdafire software. Craic FilmPro allows the user to measure the thickness of thin films rapidly and non-destructively.
Able to analyse films of many materials on both transparent and opaque substrates, Craic FilmPro enables the user to determine thin film thickness on everything from semiconductors, MEMS devices, disk drives to flat panel displays. The software can be used in many different fields and in everything from research to industrial settings.
Film Thickness Mapping
"Many of our customers want to measure the thickness of thin films of smaller and smaller sampling areas for rapid quality control of their products. Craic FilmPro is a plug-in module that can be added to a Craic Technologies microspectrophotometer to enable this capability. This software was built in response to customer requests for a powerful, flexible film thickness tool that can measure sub-micron areas on both transparent and opaque substrates.Craic Technologies microspectrophotometers equipped with Craic FilmPro meets those needs" says Paul Martin, President.
The complete Craic Technologies microspot film thickness solution combines an advanced microspectrophotometer with the sophisticated Craic FilmPro software. This software is a plug-in module to Craic Technologies Lambdafire instrument control software.
It enables the user to measure film thickness by either transmission or reflectance of many types of materials and substrates.
Due to the flexibility of the Craic Technologies design, sampling areas can range from over 100 microns across to less than a micron. Designed for both research and the production environment, it incorporates a number of easily modified processing recipes, the ability to create new film recipes and sophisticated tools for analysing data.
With the addition of spectral mapping from Craic Technologies, the firm says film thickness maps of entire devices can be created.
