+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Teledyne awarded $13 million to expand MEMS and IR capabilities

News

The subsidiary of Teledyne Technologies Incorporated will use the cash to develop MEMS infrared imaging in Canada 
Teledyne DALSA has received a financial commitment totaling $13 million from Investissement Québec to expand the company's MEMS and Infrared Imaging capabilities in the Province of Québec.

The funding consists of a $3 million grant to Teledyne DALSA Semiconductor aimed at increasing production capacity for MEMS (micro electromechanical systems) at the company's Bromont, Québec facility. 

MEMS are tiny electro-mechanical devices found in a wide variety of consumer, automotive, and telecommunications devices. Teledyne DALSA's Semiconductor division in Bromont is one of the world's  "pure-play" specialty MEMS manufacturers.

In addition, Investissement Québec is providing Teledyne DALSA a $10 million contribution to develop advanced infrared imaging products at its Bromont and Montreal facilities.

An innovator in visible and x-ray digital imaging technology, Teledyne DALSA is extending its reach into infrared imaging. Unlike visible imaging cameras and sensors, infrared devices are able to see objects not visible to the human eye by detecting the heat the objects emit.

"MEMS and Infrared Imaging are two strategic areas of focus for Teledyne DALSA with good growth potential," comments Brian Doody, CEO of Teledyne DALSA, Inc.

"The development and full production of infrared devices in Québec will further strengthen our position as a leader in digital imaging and semiconductors, at a time when the infrared imaging market is experiencing strong growth. In addition, by increasing our production capacity of MEMS chips, we will be able to meet the growing demand for microsystems as they become indispensable in many areas." 
Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: