+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

InvenSense touts first integrated 7-Axis MEMS Motion Tracking platform

News

The device which is suited to  navigation, health and fitness applications comes in a compact 3.5mm x 3.5mm x 0.9mm package

InvenSense has launched the ICM-20728, which it says is the world's first integrated 7-axis (3-axis gyroscope + 3-axis accelerometer + pressure sensor) single chip platform solution with onboard Digital Motion Processor (DMP).

The single SoC delivers MotionTracking with absolute and relative altitude change for navigation, health and fitness applications.

The new InvenSense 7-axis platform targets mobile and wearable devices such as smartphones, tablets, fitness bands, and smart watches.

The ICM-20728 SoC uses InvenSense's "˜AlwaysOn' vision and consumes approximately 2mW of power with full 7-axis and DMP active. This 7-axis motion tracking solution combines a gyroscope and accelerometer with a fully integrated pressure sensor,

InvenSense's third generation DMP, algorithms, and delivers features such as ICM-20728 is software compatible with the previously announced ICM-20628.

Also, the InvenSense platform includes a programming environment for custom motion feature development with InvenSense Gesture Language (IGL) tools and the MotionApps software is fully compliant with, and drop-in ready, for multiple operating systems, including Google's latest Android KitKat release.

"InvenSense's integrated 7-axis platform with embedded processing is another technological breakthrough for the MEMS industry," says Ali Foughi, Vice President of Marketing and Business Development at InvenSense. "With this device, InvenSense enables a new class of "˜AlwaysOn' applications and services, such as indoor navigation, activity tracking and fitness."

Sampling of the InvenSense ICM-20728 will commence within the first half of 2014.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: