SUSS MicroTec launch Projection Scanner for Advanced Packaging
SUSS MicroTec have launched the DSC300, a next generation projection scanner for advanced packaging
SUSS MicroTec's DSC300 platform for wafer sizes up to 300 mm is based on the projection lithography technology developed by SUSS MicroTec Photonic Systems Inc. (formerly Tamarack Scientific). The system combines the advantages of full-field exposure and conventional projection lithography. Equipped with a full-field mask and broadband projection optics, the scanner exposes the substrate in a single continuous mode (scanning). Additional functions can be integrated in designing the mask layout, for example exposure of substrate edges - an important requirement for subsequent process steps.
The new projection scanner platform has been enhanced with new features to meet the overlay, resolution and automation requirements of emerging advanced packaging applications like Cu pillar bumping and WLCSP..
'Following the acquisition of Tamarack Scientific in 2012, we have optimized the product portfolio, focused the business on the most promising applications and have systematically reengineered the tools to support volume production.', says Frank P. Averdung, President and CEO of SUSS MicroTec. 'The 2nd generation of the projection scanner DSC300 is another step to expand the product portfolio of SUSS MicroTec Photonic Systems.'
