News Article
Samsung pushes IoT 28nm process forward with RF
As the Internet of Things (IoT) is quickly becoming a reality, Samsung's foundry is offering chip designers the ability to integrate advanced RF functionality into their designs.
This is aimed at making connectivity applications such as the connected home appliances, auto infotainment systems and heating/cooling systems possible.
"With only a handful of companies offering advanced process technology, the options to manufacture RF capabilities into chip designs are greatly reduced," says Shawn Han, vice president of Foundry Marketing, Samsung Electronics.
"As we enter the Internet of Things era, smaller, power-efficient RF solutions provide the critical functionality for the SoC solution as smart connected devices becomes more prevalent. Samsung Foundry is collaborating with our ecosystem partners and customers to provide the most advanced, low cost, lowest power RF technology possible," he adds.
Samsung's foundry business has also released its 28RF process design kit (PDK) and verification method to several customers, which the company says has been proven by simulation and silicon results in real design. Samsung's 28RF process is built on top of the high-volume manufacturing 28LPP HKMG process.
The firm says silicon results have shown 280GHz of Ft and 400GHz of Fmax under 'normal' conditions.
Through the collaboration with EDA partners, 28RF PDK includes a design manual, SPICE models, DRC/LVS, PEX and ESD decks, along with RF specific module verification and extraction rules.
The Samsung Foundry will start mass production of the 28RF process technology in early 2015.
The firm is currently manufacturing foundry customers' 28nm designs on its 28LPS (pSION), 28LPP (HKMG) and 28LPH (HKMG) process nodes.
According to Samsung, many customer designs have been silicon-validated, and many more products are being manufactured at its logic fabs, the S1 Line and S2 Line in Korea and USA, respectively.
This is aimed at making connectivity applications such as the connected home appliances, auto infotainment systems and heating/cooling systems possible.
"With only a handful of companies offering advanced process technology, the options to manufacture RF capabilities into chip designs are greatly reduced," says Shawn Han, vice president of Foundry Marketing, Samsung Electronics.
"As we enter the Internet of Things era, smaller, power-efficient RF solutions provide the critical functionality for the SoC solution as smart connected devices becomes more prevalent. Samsung Foundry is collaborating with our ecosystem partners and customers to provide the most advanced, low cost, lowest power RF technology possible," he adds.
Samsung's foundry business has also released its 28RF process design kit (PDK) and verification method to several customers, which the company says has been proven by simulation and silicon results in real design. Samsung's 28RF process is built on top of the high-volume manufacturing 28LPP HKMG process.
The firm says silicon results have shown 280GHz of Ft and 400GHz of Fmax under 'normal' conditions.
Through the collaboration with EDA partners, 28RF PDK includes a design manual, SPICE models, DRC/LVS, PEX and ESD decks, along with RF specific module verification and extraction rules.
The Samsung Foundry will start mass production of the 28RF process technology in early 2015.
The firm is currently manufacturing foundry customers' 28nm designs on its 28LPS (pSION), 28LPP (HKMG) and 28LPH (HKMG) process nodes.
According to Samsung, many customer designs have been silicon-validated, and many more products are being manufactured at its logic fabs, the S1 Line and S2 Line in Korea and USA, respectively.
