Asia-Pacific to lead semiconductor & IC packaging market
This region accounted for more than 68 percent of the Semiconductor & IC Packaging Materials Revenues in 2013
The market for semiconductor and IC packaging materials in terms of revenue is expected to reach $26 million by 2019, growing at a CAGR of 4.5 percent from 2014 to 2019.
This is according to the report, "Semiconductor & IC Packaging Materials Market by Types (Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, and so on), Packaging Technologies (SOP, GA, QFN, DFN, and others), and Geography - Regional Trends & Forecast to 2019," by marketsandmarkets.com.
Materials used in this sector include organic substrates, bonding wires, lead frames and encapsulation resins. Each type of semiconductor and IC packaging material has its own properties and applications. These individual packaging materials have application-specific demands that are differentiated by placement, cost, and efficiency.
Organic substrates are used as base materials in semiconductor applications and manufacturing. Encapsulation resins are comparatively the latest and are especially designed to protect and insulate electronic components from external threats. The use of these semiconductor and IC packaging materials increases the efficiency of their applications.
Asia-Pacific dominated the Semiconductor and IC Packaging Materials Market revenues in 2013. This region is expected to remain the major by 2019, growing at a CAGR of 5.0 percent from 2014 to 2019.
ROW is expected to be the fastest growing markets, growing at a CAGR of 3.5 percent from 2014 to 2019.
Europe and North America are estimated to grow at a slower CAGR of 3.0 percent and 3.2 percent respectively from 2014 to 2019, owing to the rising consumption in the Asia-Pacific region, where end-user markets of semiconductor and IC packaging materials are growing steadily.
Asia-Pacific alone accounted for more than 68 percent of the Semiconductor & IC Packaging Materials Revenues in 2013. Asia-Pacific is the largest semiconductor and IC packaging market, with major developments in China, Japan, Taiwan, and South Korea.
This region is expected to dominate the market by 2019, with advanced technological developments in electronic packaging materials for end-users. Asia-Pacific is expected to remain the major semiconductor and IC packaging market by 2019, with high investments in emerging applications due to growing population and demand.
