ASE and Inotera to expand system-in-package business model
The industry partnership will broaden ASE's SiP portfolio to meet growth momentum across a broad range of end markets. Inotera and ASE intend to enhance capability in the semiconductor supply chain
Advanced Semiconductor Engineering, a semiconductor assembly and test service provider, has announced a joint development with Inotera Memories, a DRAM wafer foundry, in a move to further strengthen ASE's System-in-Package (SiP) capabilities.
Complementing ASE's portfolio, Inotera will provide manufacturing services for silicon interposer, an interconnect device on silicon wafer for 2.5D IC solutions.
This collaborative business model, combining Inotera's strong front-end wafer processing capability with ASE's advanced IC packaging and testing technology, will serve to deliver solutions featuring high quality, stable yield and an efficient cost structure, to a broader customer base and market.
Semiconductors are playing a significant role in enabling the stark sophistication evolving within today's vast technology landscape. However, semiconductor evolution is being faced with serious challenges, including the industry need for higher performance and bandwidth, lower power, and increased efficiency.
Continuously rising costs are also affecting technology adoption and market growth. According to Gartner, the PC and Server space is experiencing slow down. Hence applications driving market growth through 2017 are to be found in the ultra-mobile PC, tablet, smartphone and emerging Internet of Things (IoT) sectors.
Chip makers supplying to these segments are progressively required to integrate increased functionality within smaller form factors, therefore enabling products to be faster and smarter. IC manufacturing is playing a larger role within the supply chain and is seeking optimum improvement in regard to process and production.
ASE says it is continuously exploring and developing new technologies in package design and manufacturing, particularly advanced IC technologies such as 2.5D ICs and 3D ICs, to address market needs within the fast moving mobility space.
Essentially, SiP is a module containing an electronic system or sub-systems that utilise such 2.5/3D IC packaging technologies to miniaturise the package. Together with ASE's electronic manufacturing services (EMS) subsidiary, Universal Scientific Industrial (USI), ASE is offering customers a complete SiP solution, encompassing design to manufacturing to logistical integration.
SiP technology is integral to many end market applications including products incorporating biometric touch, sensors, wireless, power management, camera modules, RF front end and lighting, all of which are prevalent within today's vast technology landscape.
"Inotera hopes to contribute our high-quality and cost-effective manufacturing capability to ASE's SiP solution through the collaboration," says Scott Meikle, President of Inotera. "By combining strengths complementary and maintaining a full commitment to our DRAM capacity, Inotera and ASE can provide an enabling capability to the semiconductor supply chain," emphasises Meikle.
"ASE recognises that collaboration within the supply chain is critical to the success of our vision for system integration, and it is through the establishment of strong partnerships that we can work together to bring optimum value and just-in-time solutions to our customers," adds Tien Wu, Chief Operating Officer, ASE Group.
He continues, "Inotera is a proven leader in DRAM wafer fab technology and has expanded its capabilities to offer silicon interposer foundry services to benefit ASE's complete SiP solution. ASE's dedicated R&D team is developing proprietary IC packaging IPs, working with various material and equipment suppliers, as well as customers to further expand and strengthen our SiP portfolio."
