PacTech doubles capacity for electroless plating services in Asia
PacTech GmbH has announced that subsidiary PacTech Asia (Penang, Malaysia) is now doubling capacity for electroless Ni/Au and Ni/Pd wafer level plating services.
The additional clean room area is now ready for installation of a new PacLine 300 automatic electroless plating system.
Manufactured by PacTech, the PacLine 300, pictures above, is suitable for both aluminium and copper pads on 200mm & 300mm wafers, and creates additional capacity of 20,000 to 30,000 wafers per month
Thorsten Teutsch, President and COO of PacTech USA and COO of PacTech Asia comments, "We are experiencing huge success in MOSFET, RFID, LED, MEMS, and other key product areas with both major IDM's and fabless customers. PacTech Asia and PacTech USA work closely together to insure their mutual success! Over 80 percent of the volume demand results from our successful qualifications and product transfers from PacTech USA to PacTech Asia. Additionally, PacTech Asia continues to invest in more automation, inspection and test capabilities, including wafer back metal services growing to 10,000 wafers per month."
PacTech USA's Silicon Valley facility located in Santa Clara, California is not only PacTech's Equipment Sales and Demonstration Centre for the Americas, but also provides support on new designs and early production volume demands.
Expedited chip design cycles on first silicon and multi-project wafers are critical to successful design wins with key end customers. Once proven, customers are ready to ramp up production volumes, and rely on their Asia-based external foundry management teams. The "Copy Exact" process transfer from PacTech USA to PacTech Asia intends to insure the seamless transition handover.
Heinrich Luedeke, CEO of PacTech - Packaging Technologies GmbH says, "We continue to commit more investments in 2014 - 2015, supporting both our advanced equipment manufacturing unit and foundry services operations. Plans include electroplated copper capabilities, embedded die packaging solutions, and next generation high-speed solder jetting machines, as well as laser-assisted bonding equipment."
He concludes, "With over 800 production machines in the field and over 115 patents granted, the combination of PacTech's technologies allows our three locations to provide the widest product offering in the industry; servicing the ASIC, Foundry, Government, Medical, Aerospace, Consumer, Telecommunication, Memory, MEMS, Probe Card, and Hard Disc Drive industries."
