Nordson MARCH unveils plasma treatment tool for flexible substrates
The system adds desmear and etchback capabilities and increased capacity of up to 30 panels per cycle
Nordson MARCH has introduced its new FlexVIA-Plus Plasma Treatment System that delivers single-stage plasma processing - including etchback and desmear - of up to 30 panels (panel size 500 x 813 mm/ 20 x 32 inch) per cycle.
This enables a rate of as much as 200 units per hour (UPH) for the manufacture of flexible electronic PCBs and substrates.
FlexVIA-Plus Tool
The FlexVIA-Plus System's advanced horizontal electrode design, with integrated rack, provides optimum material alignment for industry-leading plasma treatment uniformity. Versatile horizontal racks allow for processing of various flexible PCB sizes and make loading easy. The efficient design with its economical gas consumption and small footprint contributes to a low cost of ownership.
Specifically designed for the processing of flexible PCBs, the new FlexVIA-Plus Plasma System delivers patented, plasma technologies that provide excellent surface activation, etchback, and desmear process uniformity on both sides of the flex material.
The desmear and etchback technologies remove epoxies, polyimides, high Tg blends, mixed materials and other resins more effectively than traditional methods of etching and desmearing. The descum capabilities effectively remove resist residue from inner layers and panels as well as residual solder mask bleed for better bonding and solderability. Temperature-controlled electrodes ensure consistent process repeatability.
"The new FlexVIA-Plus Plasma System performs similarly to our ProVIA system, but in a horizontal form-factor, which is ideal for processing flexible PCBs," says Jonathan Doan, director of marketing, Nordson MARCH. "This system meets the demands of today's high-throughput flexible circuit board manufacturing operations."
