+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

DuPont and Holst to push printed electronics research

News

The two organisations will explore this technology to advance smart packaging technologies, wearable electronics and OLED lighting

DuPont Microcircuit Materials and Holst Centre have extended their collaboration focused on advanced materials for the printed electronics industry.

The collaboration is expected to advance technology specifically in the area of wearable electronics, in-mold electronics, sensors and smart packaging and Organic Light Emitting Diode (OLED) lighting.

"DuPont is pleased to continue its collaboration with Holst Centre to enhance the potential for significant new materials for printed electronics," says Kerry Adams, European marketing manager, DuPont Microcircuit Materials. "Continued innovation will be key to unlocking new opportunities in this market as we have seen with our recent advances in nano-silver conductor inks for OLED lighting."

DuPont will continue as a partner in Holst Centre's research on printing technologies and will additionally contribute to the prototype development of wearable, formable and stretchable electronics in order to help accelerate the uptake of new materials in real applications.

The work will concentrate on optimising printed metallic structures on flexible substrates in terms of conductivity, fine line deposition and low energy sintering. A variety of roll-to roll compatible printing techniques will be studied including screen, flexography and ink jet. Alternative conductor metallurgies will be studied as well as reactive systems for depositing conductive traces.

"Holst Centre and DuPont have had a longstanding and successful collaboration," says Pim Groen, program manager, Printed Structures on Flexible Substrates. "It is exciting to extend that into new areas of technology."

DuPont will be exhibiting its full range of printed electronics offerings at stand B0-314 at LOPEC, the International Exhibition and Conference for Printed Electronics, May 26th to 28th in Munich, Germany. In addition, DuPont will be presenting its range of inks specifically for printed biosensor applications at stand11 at Biosensors 2014 in Melbourne, Australia, May 27th to 30th.

Holst Centre will also showcase the latest developments in printed electronics technology at stand B0-202.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
Adblocker Detected
Please consider unblocking adverts on this website