+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

TI expands three-phase smart e-meter SoC line

News

Texas Instruments has expanded its portfolio with low power, memory and security options. The scalable solutions leverage advanced integrated analogue and software implementations to provide flexibility across a wide range of designs


Texas Instruments (TI) has announced new three-phase metering systems-on-chip (SoC) for smart electricity meters and portable measurement applications.

The new MSP430F67641 SoCs include high-performance delta-sigma analogue-to-digital converters (ADCs) for energy measurement products requiring high accuracy across a wide dynamic range.

An integrated 320-segment LCD eliminates the need for external drivers and enables developers to create the next generation of smart energy measurement devices with detailed displays and extended language support, while still maintaining low-power consumption in sleep mode.

In addition, the new MSP430F6779A metering SoCs include advanced security and electrostatic discharge (ESD) features. A 128-bit Advanced Encryption Standard (AES) hardware-accelerated module speeds encryption time, improves meter security and performance.

With more flash memory integrated on-chip, smart grid developers can incorporate more sophisticated metering features like multi-dwelling dynamic pricing, large buffers for interval data, DLMS/COSEM for meter data formatting, and communication stacks for both wired and wireless protocols.

Developers will also benefit from TI's TPS54060 step-down converter that provides a regulated DC supply of 3.3V with low quiescent current to ensure full-speed operation of the MSP430F67641 and MSP430F6779A devices.

Additional features and benefits of TI's metering SoCs:

    MSP430F67641 devices provide 0.5 percent accuracy and MSP430F6779A devices provide Class 0.1 accuracy across a 2000:1 dynamic range through -40 to +85 degrees Celsius.

    Free Energy Library code performs all of the energy and power calculations required for ANSI/IEC qualified meters and provides an easy starting point for customers developing utility meter products.

    MSP430F67641 SoCs provide multiple low-power modes and power consumption as low as 0.78µA for developers needing to design ultra-low power metering devices.

    Simultaneous sampling of the on-chip 10-bit successive approximation (SAR) ADC with the delta-sigma ADCs eliminates software compensation for sequential sampling, which helps developers reduce the size of software code.

    Integrated on-chip memory (128KB flash on MSP430F67641 and 512KB flash on MSP430F6779A) allow developers to include communication stacks for both wired and wireless protocols, including ZigBe®, wM-Bus, power line communication (PRIME, G3-PLC, IEEE-P1901.2) and RF mesh networks.

Pricing and availability:

TI's MSP430F67641 SoCs are available immediately for USD $2.85 in 1K units.

Additionally, several development kits are available for engineers to kick start their development, including the MSP-TS430PEU128 programming and debug board ($117), MSP-FET430U128 Flash emulation tool ($175), EVM430-F67641 evaluation module ($299). The MSP430F6779A metering SoCs are available immediately for USD $6.90 in 1K units with the EVM430-F6779 evaluation module for USD $299.

 

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: