Kingyoup and IBM develop wafer bonding & debonding tool
Kingyoup Optronics at the IEEE Electronics Components and Technology Conference (ECTC) held at Orlando, Florida USA, in May 2014 show-cased its temporary bonding and debonding equipment developed in collaboration with IBM.
This equipment is specially designed to meet the microelectronics miniaturisation needs of today's smart, mobile, consumer electronics devices. Specifically, it enables 3D Integrated Circuits, 2.5D Packaging Integration and System applications.
The temporary bonding and debonding equipment uses a hybrid laser debonding solution with an throughput of over 60 to 100 wafers per hour.
It also supports wafer thinning to less than a human hair thickness (less than 50 microns) for either 200mm or 300mm wafers.
IBM and Kingyoup say they have developed a solution that demonstrates lower power consumption and much faster wafer cleaning, leading to high yield and high throughput, and concludes with lower cost of ownership.
This technology can be applied to semiconductor wafer processing and packaging technologies in either wafer level or panel size formats.
