Unisem to expand testing capacity
Unisem, a provider of semiconductor assembly and test services has added a third Teradyne UltraFLEX Test System to its US-based test development centre located in Sunnyvale, California.
The UltraFLEX is a tester for complex SOC devices in the mobile communication, processor and networking spaces. It is claimed to offer digital, RF, SERDES and DC instrumentation on ATE to provide high characterisation capability and production yields.
Unique architectural capabilities such as automatically backgrounded DSP and complete instrument control from digital patterns also provide the highest throughput.
"The addition of a third UltraFLEX machine to our Sunnyvale facility is another example of our strong partnership and collaboration with Teradyne," says Marita Erickson, General Manager of Unisem Sunnyvale. "We are pleased to be able to continue offering our customers best in class service, through our focus on providing optimal test solutions."
"Teradyne is pleased to expand our relationship with Unisem," comments Greg Smith, VP, SOC Marketing, Teradyne. "As OSATs continue to expand their range of services beyond just turnkey manufacturing, we feel it is important to partner with Unisem as they build a supply chain that encompasses the entire process from test development through volume manufacturing for the benefit of our common customers."
Unisem is a provider of outsourced semiconductor assembly and test (OSAT) services for electronics companies. The firm offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding; a wide range of leadframe and substrate IC packaging; wafer level CSP; and RF, analogue, digital, and mixed signal test.
