Koh Young to unveil 3D measurement for semiconductor applications
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Koh Young HORUS measurement on a TSV package
HORUS is designed to realise higher yields in semiconductor and advanced packaging applications by measuring objects that have previously been considered difficult to measure with appreciable speed, without sacrificing accuracy.
The company says HORUS achieves speed faster than any other inspection machine and the primary advantage is that it can measure virtually any object, and is capable of precisely measuring transparent ones at production speeds. HORUS is claimed to be the first machine with this capability to enter the market.
HORUS is designed for semiconductor applications, but it is suited for the full range of electronics manufacturing and assembly applications including board-level SMT. HORUS can measure shiny objects including flux and solder balls using its very wide Field of View (FOV) optics.
The combination of wide FOV and quick inspection speed allows HORUS to be used as an in-line inspection machine. This will also facilitate lot testing on all products, rather than traditional sampling inspection due to slow inspection speeds.
In addition to the new HORUS, Koh Young will demonstrate its other patented full 3D Measurement-based inspection solutions for AOI applications
