News Article
Fab Owners Association (FOA) now includes packaging and test
Packaging, assembly and test members can now join semiconductor device makers and industry suppliers in a collaborative forum for global manufacturing efficiency
The Fab Owners Association (FOA), a not for profit group of twenty-six semiconductor device manufacturers and nearly sixty industry suppliers, has opened membership to a select group of companies in the packaging, assembly and test segment of integrated circuit manufacturing. Founded in 2004, the FOA has been bringing together device makers and their suppliers to cooperate on innovative solutions to compete efficiently on a global scale. As the complexity of packaging technology evolves to rival that of front-end device manufacturing, the FOA sees a need for packaging and test providers to also cooperate for efficiency and is opening membership to them in a new segment FOA-PT. Benefits of FOA-PT membership include: Meetings between FOA device makers and FOA-PT members to discuss common manufacturing and industry issues as well as meetings with Associate Members (suppliers to the industry). Other networking and sponsorship opportunities throughout the year. Access to short-term and annual member surveys to gauge issues and solutions that will include inputs from device makers as well as packaging and test members. Free participation in the FOA's "SpeedNetworking" event held annually in July at SEMICON West in San Francisco, with impactful one-on-one meetings with FOA device makers. Free participation in the FOA's annual Collaborative Forum in February. FOA-PT members will get the opportunity to present case studies directly to FOA members, highlighting joint successes with device makers. "We recognise the importance of packaging and test to the success of our industry and are excited to create an FOA segment focused on these areas," comments L.T. Guttadauro, FOA Founder and Executive Director. "We have limited openings for charter members in FOA-PT who will also assist in setting the agenda for this new segment."
