eSilicon Takes Amar Hanspal On Board
eSilicon Corporation, an independent semiconductor design and manufacturing solutions provider, has taken on Amar Hanspal in its Board of Directors.
Hanspal is currently senior vice president, Information Modelling and Platform Products Group at Autodesk. In this capacity, Hanspal oversees Autodesk's core Cloud platform - Autodesk 360 - and the full range of Building Information Modelling products for the AEC Industry. He is also responsible for the Reality Capture and AutoCAD product families. He joined Autodesk in 1987 and has served in a variety of roles including VP of Autodesk Collaboration Solutions.
Amar Hanspal
Hanspal holds an MS degree in mechanical engineering from the State University of New York at Stony Brook and a BS degree in mechanical engineering from the University of Bombay.
"Amar brings a wealth of product and market development expertise to our board, much of it focused on web and Cloud software," says Jack Harding, eSilicon's president and CEO. "eSilicon is creating new business models for the semiconductor industry by leveraging the Internet, and I am confident Amar will be a valuable addition to the team."
"I am impressed with the breadth of skills and track record of successful chip delivery at eSilicon," says Amar Hanspal. "The company also has an extensive commitment to automation, both from a business and technical perspective. I believe this technology, delivered through the web, is poised to transform how chips are designed, manufactured and delivered, and I look forward to being part of the team."
