+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

Spintrac delivers new 450mm photoresist tool to Noel

News

Silicon Valley based Spintrac Systems has released its Tractrix-450 Coat-Bake system.

This system is designed to support the growing R&D market for processing 450mm semiconductor wafers.

According to Alan Kukas, president of Spintrac Systems, the first system has been shipped and installed at Noel Technologies in Campbell, California.

Due to Noel's expanding customer demand, the system delivered to Noel can also accommodate coating, baking and chilling 300mm wafers with a proprietary indexer that accommodates a 300mm FOUP cassette.


The Tractrix-450 tool comes equipped with:

    A custom 450mm loading platform for single wafer processing

    Automated transfer of the wafer through predefined process flows

    Windows OS user interface for login and creating process programs

Much of the technology has been adapted from the production Tractrix system released over a decade ago.

Leon Pearce, President of Noel Technologies, says the firm will now be able to add coated 450mm wafers to the process services it offers. The specialty foundry first offered process development for 450mm wafers in wet processes, etches, and wafer cleaning  in 2013.

Spintrac Systems Inc. produces track systems for coating, baking, and developing that are used in R&D labs and production fabs. The company's processing systems were initially targeted towards silicon wafers but now extend into compound semiconductors, sapphire, glass and ceramic varying in size from 2" to 320mm x 380mm plates to 450mm.

 

 

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: