News Article
Multiple Trymax NEO resist removal and descum systems sold
Netherlands based Trymax Semiconductor BV has sold multiple NEO resist removal and descum processing tools to a major back end supplier of advanced high technology wafer level and multi level stacked packages. The customer has 300mm wafer assembly operations in Taiwan and mainland China.
Trymax NEO platforms come with a wide range of process capability, coupled with high productivity and a low cost of ownership, and are available with flexible wafer handling and configuration options. They are ideal tools for the demands of advanced back end assembly operations.Main Features of NEO3000:
- 200 - 300 mm wafer size/substrate size
- 2 or 3 Loadports
- 5 axis dual arm vacuum or edge gripper atmospheric transfer robot (customised wafer gripper)
- 3 different process modules:
- Microwave downstream (2,45GHz)
- RF bias isotropic (13,56MHz)
- Dual source - microwave 2,45GHz plus RF bias 13,56MHz - Excellent uniformity and repeatability
- Mechanical throughput of > 220 WPH
- Fully digital controlled system, Device net - Ethernet
- Single industrial computer with Windows XP Pro operating system
- EU-RoHS Compliant
